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TDA8296HN/C1,557

NXP Semiconductors

TDA8296HN/C1,557 by NXP Semiconductors

TDA8296HN/C1,557 by NXP Semiconductors is a CMOS consumer IC designed for surface mount applications. It operates b/w -20 °C and 85 °C with power supplies of 1.2V and 3.3V, featuring a compact 40-terminal chip carrier package. Ideal for various electronic devices, it ensures reliable performance in diverse environments.

Median Price

$1.498

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,251 parts In-Stock

1+ parts

-

100+ parts

$1.470

1k+ parts

$1.220

10k+ parts

$1.090

16,251

-

$1.470

$1.220

$1.090

Verical

USA . 12,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.525

10k+ parts

$1.363

12,250

-

-

$1.525

$1.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,007 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

-

10k+ parts

-

2,007

$1.150

-

-

-

Vyrian

USA . 8,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,411

-

-

-

-

Anansix

USA . 1,230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,230

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 686 parts In-Stock

1+ parts

$1.089

100+ parts

-

1k+ parts

-

10k+ parts

-

686

$1.089

-

-

-

AZTECH Wire

Italy . 523 parts In-Stock

1+ parts

$8.870

100+ parts

-

1k+ parts

-

10k+ parts

-

523

$8.870

-

-

-

Perfect Parts

USA . 8,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,232

-

-

-

-

UNI Independent Distributors

Spain . 6,151 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,151

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Overview

Elevate your electronic designs with the TDA8296HN/C1,557 from NXP Semiconductors, a trusted leader in innovation and quality. This versatile consumer IC seamlessly integrates into various applications, delivering reliable performance in compact spaces. With robust temperature resilience and surface mount convenience, it promises enhanced efficiency and durability. Choose NXP for peace of mind and unlock the potential of your projects with this superior component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, increasing the lifespan of the product.

Surface Mount: YES

Surface mount capability allows for compact board design and efficient use of space, making it suitable for modern electronics.

Package Shape: SQUARE

The square package shape facilitates easier placement on printed circuit boards and enhances thermal management.

Power Supplies (V): 1.2, 3.3

Compatibility with multiple power supply voltages ensures versatility in application, making it suitable for various electronic devices.

No. of Terminals: 40

Forty terminals provide ample I/O connections, allowing for complex functionality and interfacing with various components.

Package Style (Meter): CHIP CARRIER

The chip carrier style supports efficient heat dissipation and easy handling during assembly, enhancing overall reliability.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows the product to be used in moderately harsh environments without risk of failure.

Minimum Operating Temperature: -20 °C

The ability to function at -20 °C ensures the product can operate in cold conditions, widening its range of applications.

Terminal Position: QUAD

Quad terminal positioning aids in easy integration into circuits and supports versatile routing options for signals.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C is conducive for reliable soldering, ensuring strong connections to the PCB.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable in digital applications.

Terminal Form: NO LEAD

No lead design reduces the product's footprint and supports lead-free soldering requirements, making it eco-friendly.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a denser layout, making it ideal for modern compact electronic designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can be handled in moderate moisture environments, providing versatility in storage and usage.

Technical Specifications

Other Function Consumer ICs TDA8296HN/C1,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA8296HN/C1,557 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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