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TDA7050T/N3,112

NXP Semiconductors

TDA7050T/N3,112 by NXP Semiconductors

NXP Semiconductors' TDA7050T/N3,112 is an 8-terminal audio amplifier IC with a nominal output power of 0.075W and gain of 26dB. It operates at a min supply voltage of 1.6V and max supply voltage of 6V, making it suitable for low-power audio applications in compact devices due to its small outline package style.

Median Price

$0.921

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Ozdisan Elektronik

Türkiye . 375 parts In-Stock

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$0.921

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Vyrian

USA . 8,909 parts In-Stock

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A&K Electronics

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Rotakorn

Sweden . 6,500 parts In-Stock

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Bristol Electronics

USA . 6,500 parts In-Stock

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Anansix

USA . 2,235 parts In-Stock

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Digiode

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Cogito LLC

Ukraine . 500 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 454 parts In-Stock

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AZTECH Wire

Italy . 208 parts In-Stock

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$8.385

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Microchip USA

USA . 191 parts In-Stock

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$10.658

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One Stop Electronics

USA . 1,604 parts In-Stock

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$12.800

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Ampacity Inc.

Singapore . 854 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,209 parts In-Stock

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GreenTree Electronics

Israel . 11,960 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,666 parts In-Stock

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Perfect Parts

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UNI Independent Distributors

Spain . 650 parts In-Stock

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your audio experience with the TDA7050T/N3,112 by NXP Semiconductors, a high-quality audio amplifier perfect for various applications. Designed with precision and expertise, this amplifier delivers exceptional sound performance, making it ideal for amplifying audio in small devices like smartphones, tablets, and portable speakers. With its compact size and advanced technology, you can enjoy clear and powerful sound wherever you go. Upgrade your audio systems with the TDA7050T/N3,112 and immerse yourself in superior sound quality like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the amplifier, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic circuit boards.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and potential for customization.

Nominal Output Power: 0.075 W

With a nominal output power of 0.075W, this amplifier can deliver sufficient power for audio applications while being energy efficient.

No. of Channels: 2

Dual channels provide stereo sound output, enhancing the audio experience for users.

Gain: 26 dB

A gain of 26 dB ensures that the amplifier can boost the audio signal to an optimal level, resulting in clear and amplified sound output.

Technical Specifications

Audio & Video Amplifiers TDA7050T/N3,112 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

Gain:

26 dB

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Terminals:

8

Nominal Output Power:

.075 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

4 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.6 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TDA7050T/N3,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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