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TDA6101Q/N3

NXP Semiconductors

TDA6101Q/N3 by NXP Semiconductors

VIDEO AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; No. of Functions: 1;

Median Price

-

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,434 parts In-Stock

1+ parts

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4,434

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Vyrian

USA . 3,227 parts In-Stock

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3,227

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ComSIT Distribution GmbH

Germany . 2,376 parts In-Stock

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2,376

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Lakeland Logistics Inc

USA . 2,364 parts In-Stock

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2,364

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Bristol Electronics

USA . 2,364 parts In-Stock

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2,364

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Anansix

USA . 2,232 parts In-Stock

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2,232

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R&J Components

USA . 2,219 parts In-Stock

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2,219

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Fibra_Brandt Electronic GMBH

Germany . 8 parts In-Stock

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8

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Huijzer Components

Netherlands . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,273 parts In-Stock

1+ parts

$16.800

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1,273

$16.800

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Corphita

USA . 3,536 parts In-Stock

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3,536

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Assy Fe

Spain . 2,870 parts In-Stock

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2,870

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UNI Independent Distributors

Spain . 597 parts In-Stock

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597

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Technical Specifications

Audio & Video Amplifiers TDA6101Q/N3 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

9 kHz

General IC Type:

JESD-30 Code:

R-PZFM-T9

JESD-609 Code:

e3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Current:

6 mA

Maximum Supply Voltage (Vsup):

210 V

Minimum Supply Voltage (Vsup):

180 V

Surface Mount:

NO

Technology:

DMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA6101Q/N3 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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