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TDA6107JF

NXP Semiconductors

TDA6107JF by NXP Semiconductors

VIDEO AMPLIFIER; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: ZIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;

Median Price

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Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Anansix

USA . 2,109 parts In-Stock

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Digiode

USA . 1,896 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

Germany . 274 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 146 parts In-Stock

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Extreme Components

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Donberg Electronics Ltd

Ireland . 31 parts In-Stock

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Sinequanon

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LittleDiode

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Elcom Components

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Fibra_Brandt Electronic GMBH

Germany . 4 parts In-Stock

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ECAB

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GES GmbH

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,268 parts In-Stock

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One Stop Electronics

USA . 579 parts In-Stock

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Kepictronics

USA . 69,600 parts In-Stock

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UNI Independent Distributors

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Corphita

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Infinite Electronics LLP (Excess)

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Technical Specifications

Audio & Video Amplifiers TDA6107JF attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PZFM-T9

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

9

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP9,.1,100TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

200

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage (Vsup):

210 V

Minimum Supply Voltage (Vsup):

180 V

Surface Mount:

NO

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TDA6107JF General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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