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TDA2615/N1,112

NXP Semiconductors

TDA2615/N1,112 by NXP Semiconductors

AUDIO AMPLIFIER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Nominal Output Power: 8 W;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,575 parts In-Stock

1+ parts

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7,575

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Digiode

USA . 924 parts In-Stock

1+ parts

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924

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Anansix

USA . 658 parts In-Stock

1+ parts

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658

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Bas Electronics GmbH & Co. KG

Germany . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 178 parts In-Stock

1+ parts

$1.876

100+ parts

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178

$1.876

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One Stop Electronics

USA . 795 parts In-Stock

1+ parts

$7.800

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795

$7.800

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AZTECH Wire

Italy . 1,038 parts In-Stock

1+ parts

$16.710

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1,038

$16.710

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UNI Independent Distributors

Spain . 4,311 parts In-Stock

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4,311

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QUARKTWIN TECHNOLOGY LTD

USA . 3,875 parts In-Stock

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3,875

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Corphita

USA . 566 parts In-Stock

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566

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Perfect Parts

USA . 222 parts In-Stock

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222

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Technical Specifications

Audio & Video Amplifiers TDA2615/N1,112 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

30 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PSFM-T9

JESD-609 Code:

e3

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

9

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-25 Cel

Nominal Output Power:

8 W

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP9,.1TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

70 mA

Maximum Supply Voltage (Vsup):

21 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

TDA2615/N1,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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