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T2322B

NXP Semiconductors

T2322B by NXP Semiconductors

4 QUADRANT LOGIC LEVEL TRIAC; Package Style (Meter): FLANGE MOUNT; Surface Mount: NO; Terminal Position: SINGLE; Configuration: SINGLE; No. of Terminals: 3;

Median Price

$3.175

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Ace Electronics

USA . 311 parts In-Stock

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$3.000

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TEDSS.com

USA . 181 parts In-Stock

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$3.350

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$2.950

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Vyrian

USA . 5,866 parts In-Stock

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North Shore Components

USA . 2,200 parts In-Stock

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Anansix

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Resion

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Digiode

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MISTER SPROCKETS

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Corohmni

South Africa . 434 parts In-Stock

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One Stop Electronics

USA . 126 parts In-Stock

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$24.100

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Kepictronics

USA . 13,000 parts In-Stock

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UNI Independent Distributors

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TANS Electronics

Latvia . 4,652 parts In-Stock

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Problanco Electronics

Mexico . 3,526 parts In-Stock

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Corphita

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 891 parts In-Stock

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J Silver Components DBA - Lantern Electronics

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SupplyDigital Components

Austria . 287 parts In-Stock

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Technical Specifications

Triode For Alternating Current (TRIAC) T2322B attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from NXP Semiconductors

Specs

Configuration:

JEDEC-95 Code:

TO-126

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

2.5 A

Repetitive Peak Off-state Voltage:

200 V

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T2322B Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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