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SSL3252UK/C2,515

NXP Semiconductors

SSL3252UK/C2,515 by NXP Semiconductors

SSL3252UK/C2,515 by NXP Semiconductors is a robust graphics display driver designed for industrial applications. It operates within a temperature range of -40 °C to 85 °C and supports power supplies of 3/5V. This surface-mount device features a fine pitch grid array with 12 terminals for efficient connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,803 parts In-Stock

1+ parts

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5,803

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Anansix

USA . 2,046 parts In-Stock

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2,046

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Digiode

USA . 900 parts In-Stock

1+ parts

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900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,287 parts In-Stock

1+ parts

$5.500

100+ parts

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1,287

$5.500

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Microchip USA

USA . 394 parts In-Stock

1+ parts

$5.833

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394

$5.833

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AZTECH Wire

Italy . 699 parts In-Stock

1+ parts

$21.970

100+ parts

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699

$21.970

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Ampacity Inc.

Singapore . 605 parts In-Stock

1+ parts

$35.500

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605

$35.500

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UNI Independent Distributors

Spain . 5,443 parts In-Stock

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5,443

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QUARKTWIN TECHNOLOGY LTD

USA . 4,323 parts In-Stock

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4,323

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Corphita

USA . 4,047 parts In-Stock

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4,047

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Overview

Elevate your graphics display capabilities with the SSL3252UK/C2,515 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a robust solution designed for diverse applications in the industrial sector. This versatile graphics display driver ensures exceptional reliability and performance, operating seamlessly in extreme temperatures. Experience enhanced visual clarity and efficiency—transforming your projects into stunning realities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards, enhancing versatility in product development.

Package Shape: RECTANGULAR

The rectangular shape supports efficient layout design, aiding in space-saving and optimal performance in electronic assemblies.

Power Supplies: 3/5 V

Compatible with both 3V and 5V power supplies, this driver offers flexibility in design and can cater to a range of applications.

No. of Terminals: 12

Twelve terminals provide sufficient connectivity options, allowing for the expansion of functionality within the graphics display systems.

Package Style: GRID ARRAY, FINE PITCH

The fine pitch grid array facilitates high-density designs, enabling the use of advanced technology and improving performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the driver can perform reliably in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Its ability to operate at a minimum temperature of -40 °C ensures functionality in extreme cold conditions, ideal for outdoor or harsh environments.

Terminal Position: BOTTOM

Bottom terminal positioning enhances ease of soldering and improves thermal performance, making assembly processes more efficient.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this driver is designed for long-term reliability in demanding applications.

Terminal Form: BALL

Ball terminal form provides a reliable connection with lower inductance, which is beneficial for high-performance electronic applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for compact layouts, enabling designs that conserve space without compromising electrical performance.

Technical Specifications

Graphics Display Drivers SSL3252UK/C2,515 attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PBGA-B12

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

SSL3252UK/C2,515 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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