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SSL3252UK/C2,518

NXP Semiconductors

SSL3252UK/C2,518 by NXP Semiconductors

SSL3252UK/C2,518 by NXP Semiconductors is a robust graphics display driver designed for industrial applications. It operates within a temperature range of -40 °C to 85 °C and supports power supplies of 3/5V. This surface mount device features a fine pitch grid array with 12 terminals for efficient connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,522 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,522

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-

-

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Digiode

USA . 906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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906

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Vyrian

USA . 566 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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566

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 299 parts In-Stock

1+ parts

$48.500

100+ parts

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1k+ parts

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10k+ parts

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299

$48.500

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UNI Independent Distributors

Spain . 4,985 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,985

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Corphita

USA . 2,876 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,876

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Overview

Elevate your display capabilities with the SSL3252UK/C2,518 from NXP Semiconductors, a trusted leader in innovative technology. Designed for exceptional performance in graphics display applications, this premium driver ensures vibrant visuals and reliability across extreme temperatures. With its compact design and robust quality, transform your projects into stunning showcases while benefiting from NXP’s commitment to excellence and support, making it the ideal choice for industrial needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material enhances durability and provides protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for efficient use of space and makes the driver compatible with modern PCB designs, contributing to a compact and lightweight overall assembly.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board space and facilitates easy placement and repeatable alignment during assembly.

Power Supplies (V): 3/5

Supporting dual voltage power supplies (3V and 5V) allows for flexible integration into various systems, accommodating a wide range of power requirements.

No. of Terminals: 12

With 12 terminals, this device offers a good balance of connectivity options, allowing for sufficient input/output capability without overcrowding.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style ensures efficient heat dissipation and improved electrical performance, making it ideal for high-density applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in harsher environments, making this driver suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can function effectively in extreme cold conditions, enhancing versatility in different climates.

Terminal Position: BOTTOM

The bottom terminal position is advantageous for better thermal performance and allows for easier mounting on PCBs for optimized space utilization.

Temperature Grade: INDUSTRIAL

An industrial temperature grade specification makes this driver especially reliable for use in demanding applications where temperature fluctuations are common.

Terminal Form: BALL

Ball terminal form provides excellent mechanical stability and enhances solder joint reliability, crucial for long-term performance in various environments.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is suitable for high-density layouts, offering flexibility in design while maintaining performance, thus catering to advanced electronics.

Technical Specifications

Graphics Display Drivers SSL3252UK/C2,518 attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PBGA-B12

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

SSL3252UK/C2,518 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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