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SSL2101T/DB/BCB120

NXP Semiconductors

SSL2101T/DB/BCB120 by NXP Semiconductors

SSL2101T/DB/BCB120 from NXP Semiconductors is a robust graphics display driver designed for industrial applications. It operates within a wide voltage range of 8.5-40V and features a dual terminal configuration with a max temp of 100 °C. Its compact SO package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,696

-

-

-

-

Digiode

USA . 2,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,722

-

-

-

-

Anansix

USA . 2,068 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,068

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 272 parts In-Stock

1+ parts

$18.500

100+ parts

-

1k+ parts

-

10k+ parts

-

272

$18.500

-

-

-

UNI Independent Distributors

Spain . 6,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,780

-

-

-

-

Corphita

USA . 942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

942

-

-

-

-

Overview

Elevate your visual experience with the SSL2101T/DB/BCB120 from NXP Semiconductors, a leader in innovative technology. This robust graphics display driver ensures exceptional performance across diverse applications, from industrial displays to consumer electronics. With its reliable design and wide operating temperature range, you can trust in enhanced quality and longevity. Choose NXP for superior value, efficiency, and peace of mind in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides excellent durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and efficient use of PCB space, making it ideal for modern electronic systems.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into various circuit layouts, enhancing design flexibility.

Power Supplies (V): 8.5/40

The wide voltage range of 8.5 to 40V supports diverse power supply configurations, allowing compatibility with various systems.

No. of Terminals: 16

Having 16 terminals provides multiple connectivity options, ensuring versatility in circuit designs and connections.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables space-efficient designs, ideal for compact electronic devices and applications.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100 °C, this driver can function effectively in high-temperature environments, enhancing reliability.

Minimum Operating Temperature: -40 °C

The capability to operate at temperatures as low as -40 °C makes this product suitable for harsh environments and extreme conditions.

Terminal Position: DUAL

The dual terminal position optimizes electrical performance and layout efficiency, facilitating better signal integrity.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures performance reliability in challenging conditions, making this product ideal for various industrial applications.

Terminal Form: GULL WING

Gull wing terminals provide a secure solder joint and are easier to inspect and solder, resulting in improved assembly efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for high-density mounting of components, maximizing space usage on circuit boards.

Technical Specifications

Graphics Display Drivers SSL2101T/DB/BCB120 attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8.5/40

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SSL2101T/DB/BCB120 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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