Loading...

SSL2101T/DB/BCB230

NXP Semiconductors

SSL2101T/DB/BCB230 by NXP Semiconductors

SSL2101T/DB/BCB230 from NXP Semiconductors is a robust graphics display driver designed for industrial applications. It operates within a wide voltage range of 8.5-40V and features a dual terminal configuration with a max temp of 100 °C. Its compact SO package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,632

-

-

-

-

Vyrian

USA . 2,591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,591

-

-

-

-

Anansix

USA . 1,114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,114

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 211 parts In-Stock

1+ parts

$49.500

100+ parts

-

1k+ parts

-

10k+ parts

-

211

$49.500

-

-

-

UNI Independent Distributors

Spain . 2,654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,654

-

-

-

-

Corphita

USA . 159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

159

-

-

-

-

Overview

Elevate your display solutions with the SSL2101T/DB/BCB230 from NXP Semiconductors. Renowned for quality and innovation, NXP ensures this graphics display driver offers unparalleled performance and reliability in industrial applications. With a robust temperature range and compact design, it seamlessly integrates into your projects, enhancing visual clarity while reducing power consumption. Experience the perfect blend of efficiency and durability—unlock your designs’ full potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient space utilization on PCBs, making this product suitable for modern electronic devices.

Package Shape: RECTANGULAR

A rectangular package shape facilitates easy integration into electronic layouts, ensuring compatibility with a wide range of circuit designs.

Power Supplies (V): 8.5/40

This wide voltage range allows flexibility in power supply options, making the product adaptable to various applications with different power requirements.

No. of Terminals: 16

Having 16 terminals allows for multiple connections, enhancing the potential for complex functionalities and interfacing in advanced electronics.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in reducing the overall footprint of the device, making it ideal for space-constrained applications.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100 °C, this product can withstand high heat environments, ensuring reliability under demanding conditions.

Minimum Operating Temperature: -40 °C

Operational capability at -40 °C ensures the product performs well in extreme cold conditions, making it suitable for industrial and outdoor applications.

Terminal Position: DUAL

Dual terminal position provides versatility in mounting options, allowing easier connections and improved device configuration.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grade signifies robust performance and reliability in harsh industrial environments, enhancing product longevity.

Terminal Form: GULL WING

Gull wing terminal form offers strong mechanical attachment and excellent soldering characteristics, which contribute to a reliable electrical connection.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for a compact layout without compromising on the connectivity, ideal for high-density designs.

Technical Specifications

Graphics Display Drivers SSL2101T/DB/BCB230 attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8.5/40

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SSL2101T/DB/BCB230 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19