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SP5746CHK1AVKU6R

NXP Semiconductors

SP5746CHK1AVKU6R by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLQFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,274 parts In-Stock

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4,274

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Digiode

USA . 3,969 parts In-Stock

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3,969

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Anansix

USA . 1,331 parts In-Stock

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1,331

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 763 parts In-Stock

1+ parts

$1.000

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763

$1.000

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AZTECH Wire

Italy . 963 parts In-Stock

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$8.670

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963

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One Stop Electronics

USA . 1,542 parts In-Stock

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$29.000

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$29.000

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Vigor

Singapore . 5,568 parts In-Stock

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$44.410

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5,568

$44.410

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Microchip USA

USA . 1,624 parts In-Stock

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$58.503

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1,624

$58.503

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Corphita

USA . 3,120 parts In-Stock

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UNI Independent Distributors

Spain . 2,385 parts In-Stock

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Technical Specifications

Microcontrollers SP5746CHK1AVKU6R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e3

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

1

No. of I/O Lines:

129

No. of Terminals:

176

No. of Timers:

64

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Current:

264 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

131072

Connectivity:

DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4)

Peripherals:

ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT

Analog To Digital Convertors:

31-Ch 12-Bit, 68-Ch 10-Bit

Trade Compliance

SP5746CHK1AVKU6R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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