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SP5747GTK0AMKU6R

NXP Semiconductors

SP5747GTK0AMKU6R by NXP Semiconductors

The NXP Semiconductors SP5747GTK0AMKU6R microcontroller features a 32-bit CPU with 64 timers, 31-Ch 12-Bit ADC, and 68-Ch 10-Bit ADC. It is suitable for applications requiring ISO 26262 compliance, such as automotive control systems and industrial automation. With a max clock frequency of 40 MHz and low power mode capability, it offers high performance while conserving energy.

Median Price

$43.040

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 4,451 parts In-Stock

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DigiKey

USA . 451 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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$31.962

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Flip Electronics

USA . 4,451 parts In-Stock

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Digiode

USA . 4,370 parts In-Stock

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Vyrian

USA . 2,020 parts In-Stock

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Anansix

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Distributors (Availability)

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Continental Prestige Electronics

USA . 388 parts In-Stock

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$31.962

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$31.323

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Netroflash

USA . 100 parts In-Stock

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Ampacity Inc.

Singapore . 2,149 parts In-Stock

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Vigor

Singapore . 1,362 parts In-Stock

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Microchip USA

USA . 3,149 parts In-Stock

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UNI Independent Distributors

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Argo Parts USA

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Overview

Unlock the next level of innovation with the SP5747GTK0AMKU6R microcontroller by NXP Semiconductors. Designed with precision and reliability in mind, this cutting-edge product offers a wide range of applications for your technological projects. From its integrated cache to its low power mode, the SP5747GTK0AMKU6R delivers unparalleled performance and efficiency. Embrace the future of technology with this innovative solution that is sure to exceed your expectations. Elevate your projects to new heights with the SP5747GTK0AMKU6R microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability.

Integrated Cache: YES

Enhances processing speed and efficiency by storing frequently accessed data for quick retrieval.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.32 V

Operates efficiently within a safe voltage range, ensuring optimal performance and longevity.

On Chip Data RAM Width: 8

Provides sufficient memory width for data processing and storage, improving the microcontroller's capabilities.

Screening Level: ISO 26262

Meets international safety standards for automotive functional safety, making it suitable for automotive applications.

Package Shape: SQUARE

Facilitates easy handling and placement within electronic devices, optimizing space utilization.

Bit Size: 32

Offers a high processing capacity for handling complex operations and algorithms efficiently.

No. of Terminals: 176

Provides ample connectivity options for interfacing with various components and peripherals in a system.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Offers flexibility in packaging options for different design requirements, ensuring compatibility with diverse applications.

Minimum Supply Voltage: 1.2 V

Supports low-power operation, reducing energy consumption and heat generation in the system.

Technical Specifications

Microcontrollers SP5747GTK0AMKU6R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e3

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

1

No. of I/O Lines:

129

No. of Terminals:

176

No. of Timers:

64

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Current:

264 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4)

Peripherals:

ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT

Analog To Digital Convertors:

31-Ch 12-Bit, 68-Ch 10-Bit

Trade Compliance

SP5747GTK0AMKU6R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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