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SCC2691AC1A28,602

NXP Semiconductors

SCC2691AC1A28,602 by NXP Semiconductors

NXP Semiconductors' SCC2691AC1A28,602 is a Serial Communication Controller with 5V supply, 4 MHz clock frequency, and 0.0046875 MBps data rate. It is used for asynchronous communication in serial IO applications. The chip carrier package has a square shape and operates b/w 0 to 70°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

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Nova Conductors

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Ampacity Inc.

Singapore . 207 parts In-Stock

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AZTECH Wire

Italy . 647 parts In-Stock

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One Stop Electronics

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Microchip USA

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Overview

Enhance your communication systems with the SCC2691AC1A28,602 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors ensures top-quality products like this Serial Communication Controller for seamless data transfer. Ideal for various applications, this chip carrier offers low power consumption, high-speed data transmission, and reliable performance. Upgrade your technology with the SCC2691AC1A28,602 and experience the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for long-lasting performance.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages for flexibility in different applications.

Maximum Data Transfer Rate: 0.0046875 MBps

Efficient data transfer rate for quick communication between devices.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication and bit-wise transmission for versatile connectivity options.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Technical Specifications

Serial Communication Controllers SCC2691AC1A28,602 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.0046875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

1

No. of Serial I/Os:

1

No. of Terminals:

28

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

SCC2691AC1A28,602 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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