Loading...

SC16C554BIB80,528

NXP Semiconductors

SC16C554BIB80,528 by NXP Semiconductors

SC16C554BIB80,528 by NXP Semiconductors is a Serial Communication Controller with 3.63V max supply voltage and 0.625 MBps data transfer rate. Ideal for industrial applications requiring high-speed asynchronous communication at up to 80 MHz clock frequency. Package style: Flatpack, low profile, fine pitch.

Median Price

$11.833

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$11.833

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$11.833

-

-

-

Vyrian

USA . 3,578 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,578

-

-

-

-

Digiode

USA . 2,825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,825

-

-

-

-

Anansix

USA . 1,010 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,010

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 549 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

549

$1.000

-

-

-

AZTECH Wire

Italy . 533 parts In-Stock

1+ parts

$5.646

100+ parts

-

1k+ parts

-

10k+ parts

-

533

$5.646

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$11.833

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$11.833

-

-

-

Vigor

Singapore . 782 parts In-Stock

1+ parts

$14.620

100+ parts

-

1k+ parts

-

10k+ parts

-

782

$14.620

-

-

-

Microchip USA

USA . 269 parts In-Stock

1+ parts

$23.637

100+ parts

-

1k+ parts

-

10k+ parts

-

269

$23.637

-

-

-

Ampacity Inc.

Singapore . 878 parts In-Stock

1+ parts

$32.000

100+ parts

-

1k+ parts

-

10k+ parts

-

878

$32.000

-

-

-

UNI Independent Distributors

Spain . 4,759 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,759

-

-

-

-

Corphita

USA . 733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

733

-

-

-

-

Overview

Enhance your communication systems with the SC16C554BIB80,528 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-quality Serial Communication Controllers that offer reliable performance and seamless integration. This versatile product is perfect for a wide range of applications, providing customers with increased efficiency and flexibility in their projects. Trust NXP Semiconductors to provide you with a superior solution for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the components inside, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and making it suitable for automated manufacturing processes.

Maximum Supply Voltage: 3.63 V

With a maximum supply voltage of 3.63 V, this product can be used in a variety of applications without the risk of overloading the circuit.

Address Bus Width: 3

A wider address bus width of 3 allows for efficient data transfer and communication between components, improving overall performance.

Package Shape: SQUARE

The square package shape is compact and space-saving, making it suitable for applications where board space is limited.

Power Supplies (V): 2.5/5

With dual power supply options of 2.5V and 5V, this product offers flexibility in design and compatibility with different power sources.

No. of Terminals: 80

Having 80 terminals allows for versatile connectivity options and the ability to interface with multiple devices or components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers a compact and slim design, making it suitable for applications where space is a constraint.

Minimum Supply Voltage: 2.97 V

With a minimum supply voltage of 2.97V, this product can operate efficiently even at lower voltage levels, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the product can withstand harsh environmental conditions without compromising performance.

Maximum Data Transfer Rate: 0.625 MBps

With a high data transfer rate of 0.625 MBps, this product enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish: TIN

The use of tin as the terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

Terminal Position: QUAD

The quad terminal position allows for easy and secure mounting on the circuit board, ensuring stable connections and reducing the risk of disconnection.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm enables a slim and compact design, making it suitable for applications with height restrictions.

Width: 12 mm

The narrow width of 12 mm saves space on the circuit board, making it suitable for compact designs and applications with limited space.

External Data Bus Width: 8

An external data bus width of 8 allows for efficient data transfer between external devices, enhancing overall system performance and responsiveness.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol and bit-level data transfer ensures compatibility with a wide range of devices and systems, making it a versatile choice.

Maximum Clock Frequency: 80 MHz

With a high maximum clock frequency of 80 MHz, this product can handle high-speed data processing and communication, making it suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature of 260°C ensures efficient and precise soldering during manufacturing, reducing the risk of overheating.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring reliable connections and assembly.

Length: 12 mm

The compact length of 12 mm saves space on the circuit board, making it suitable for small and compact designs where size is a constraint.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in rugged industrial environments, making it a durable choice for industrial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

As a serial IO/communication controller, this product is designed to manage serial communication and data transfer efficiently, making it a reliable choice for serial communication applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable mounting on the circuit board and reducing the risk of disconnection.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this product offers stable and reliable performance, making it suitable for a wide range of applications that require consistent power supply.

No. of Serial I/Os: 4

With 4 serial I/Os, this product can handle multiple input and output data streams simultaneously, enhancing data transfer efficiency and overall system performance.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for close spacing of terminals on the circuit board, enabling compact and space-saving designs for applications with limited board space.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this product is resistant to moisture-related damage during storage and handling, ensuring long-term reliability and durability.

Technical Specifications

Serial Communication Controllers SC16C554BIB80,528 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V AND 5V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

4

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

SC16C554BIB80,528 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20