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SC16C2550BIA44,518

NXP Semiconductors

SC16C2550BIA44,518 by NXP Semiconductors

SC16C2550BIA44,518 by NXP Semiconductors is a Serial Communication Controller with 3.63V max supply voltage and 0.625 MBps data transfer rate. It is used in industrial applications for asynchronous communication at up to 80MHz clock frequency. Package style: CHIP CARRIER, Terminal finish: Tin (Sn), Technology: CMOS.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 4,753 parts In-Stock

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Anansix

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Nova Conductors

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Bristol Electronics

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AZTECH Wire

Italy . 717 parts In-Stock

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Microchip USA

USA . 477 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$25.774

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$23.454

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$21.135

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One Stop Electronics

USA . 1,519 parts In-Stock

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Ampacity Inc.

Singapore . 1,252 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Aranea Global

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Overview

Upgrade your serial communication with the SC16C2550BIA44,518 by NXP Semiconductors. Known for their top-quality products, NXP Semiconductors delivers cutting-edge technology in the form of this serial communication controller. Ideal for a wide range of applications, this chip carrier package offers fast data transfer rates and reliable performance. With a broad operating temperature range and multiple power supply options, this industrial-grade controller provides customers with unparalleled value and flexibility for their projects. Experience the advantages of NXP Semiconductors with the SC16C2550BIA44,518.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronic devices.

Maximum Supply Voltage: 3.63 V

Allows for a wide range of input voltages, providing flexibility in power supply options.

Communication Protocol: ASYNC, BIT

Supports asynchronous data transfer and bit-oriented communication protocols, making it versatile for various communication needs.

Maximum Clock Frequency: 80 MHz

The high clock frequency enables fast data processing and communication, suitable for applications that require real-time data transfer.

Temperature Grade: INDUSTRIAL

Designed to operate efficiently in industrial temperature ranges, ensuring reliability in harsh environments.

Technical Specifications

Serial Communication Controllers SC16C2550BIA44,518 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.5862 mm

Trade Compliance

SC16C2550BIA44,518 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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