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SA602AD/01-T

NXP Semiconductors

SA602AD/01-T by NXP Semiconductors

SA602AD/01-T by NXP Semiconductors is a RF/Microwave Mixer with 8 terminals, operating at -40 to 85°C. It requires 6V power supply, draws max 2.8mA current, and uses bipolar technology. The package body material is plastic/epoxy with nickel/palladium/gold/silver terminal finish, suitable for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,422 parts In-Stock

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1,422

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Digiode

USA . 1,013 parts In-Stock

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1,013

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Vyrian

USA . 583 parts In-Stock

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583

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 782 parts In-Stock

1+ parts

$1.000

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782

$1.000

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Corohmni

South Africa . 531 parts In-Stock

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$2.401

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531

$2.401

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Ampacity Inc.

Singapore . 1,014 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 389 parts In-Stock

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$16.156

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389

$16.156

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One Stop Electronics

USA . 1,590 parts In-Stock

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$28.000

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$28.000

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Continental Prestige Electronics

USA . 5,969 parts In-Stock

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UNI Independent Distributors

Spain . 5,432 parts In-Stock

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Bastille Electronics

Australia . 2,632 parts In-Stock

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Argo Parts USA

USA . 1,297 parts In-Stock

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Corphita

USA . 970 parts In-Stock

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970

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Overview

Unleash the power of cutting-edge technology with the SA602AD/01-T by NXP Semiconductors. This RF/Microwave Mixer offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this product provides exceptional value by delivering seamless performance and efficiency. Elevate your projects to new heights with the SA602AD/01-T, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and resistant to environmental factors, ensuring durability and reliability.

Power Supplies (V): 6

Operating at a low power supply of 6V makes this product energy-efficient and cost-effective for users.

No. of Terminals: 8

Having 8 terminals allows for more connectivity options and flexibility in usage, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand extreme environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the product can operate in cold environments efficiently.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

The use of various metals for terminal finish provides corrosion resistance and ensures a reliable electrical connection for improved performance.

Technology: BIPOLAR

Bipolar technology enables high-speed and high-frequency operation, making this product ideal for RF/microwave applications that require precision and efficiency.

Maximum Supply Current: 2.8 mA

With a low maximum supply current of 2.8 mA, this product is power-efficient and helps in reducing energy consumption for the overall system.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy integration onto PCBs, saving space and making installation convenient for users.

Technical Specifications

RF/Microwave Mixers SA602AD/01-T attributes and parameters. Explore more RF/Microwave Mixers devices from NXP Semiconductors

Specs

JESD-609 Code:

e4

Mounting Feature:

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

SOP8,.25

Power Supplies (V):

6

Sub-Category:

RF/Microwave Mixers

Maximum Supply Current:

2.8 mA

Technology:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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