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SA58672UK,027

NXP Semiconductors

SA58672UK,027 by NXP Semiconductors

AUDIO AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 9; Package Code: VFBGA; Package Shape: RECTANGULAR;

Median Price

$0.749

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 42 parts In-Stock

1+ parts

-

100+ parts

$0.749

1k+ parts

$0.621

10k+ parts

$0.554

42

-

$0.749

$0.621

$0.554

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,499 parts In-Stock

1+ parts

$0.582

100+ parts

-

1k+ parts

-

10k+ parts

-

2,499

$0.582

-

-

-

Vyrian

USA . 3,563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,563

-

-

-

-

Anansix

USA . 2,328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,328

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,986 parts In-Stock

1+ parts

$0.520

100+ parts

-

1k+ parts

-

10k+ parts

-

3,986

$0.520

-

-

-

Corphita

USA . 1,289 parts In-Stock

1+ parts

$0.552

100+ parts

-

1k+ parts

-

10k+ parts

-

1,289

$0.552

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$1.425

100+ parts

$1.297

1k+ parts

$1.168

10k+ parts

-

100

$1.425

$1.297

$1.168

-

AZTECH Wire

Italy . 268 parts In-Stock

1+ parts

$12.120

100+ parts

-

1k+ parts

-

10k+ parts

-

268

$12.120

-

-

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Microchip USA

USA . 11,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,330

-

-

-

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UNI Independent Distributors

Spain . 3,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,100

-

-

-

-

Technical Specifications

Audio & Video Amplifiers SA58672UK,027 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

R-PBGA-B9

Length:

1.71 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

3 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA9,3X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.64 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

4.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.66 mm

Trade Compliance

SA58672UK,027 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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