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SA5224D

NXP Semiconductors

SA5224D by NXP Semiconductors

SA5224D by NXP Semiconductors is a telecom interface IC with 16 terminals, operating at 5V. It has a small outline package style, suitable for industrial temperature grades. With a max supply current of 0.035mA, it is ideal for telecom circuit applications.

Median Price

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Lifecycle Status

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Digiode

USA . 2,638 parts In-Stock

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Anansix

USA . 2,228 parts In-Stock

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Vyrian

USA . 830 parts In-Stock

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830

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ECAB

Sweden . 276 parts In-Stock

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Semi Source

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Sunrise Surplus Inc.

USA . 125 parts In-Stock

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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Dark Horse Electronics

USA . 35 parts In-Stock

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Holdelec - ElecDif-Pro

France . 35 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 17 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Sogenti Electronics

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Aztec Data Supply Inc.

USA . 4,792 parts In-Stock

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$6.710

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AZTECH Wire

Italy . 629 parts In-Stock

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Corohmni

South Africa . 33 parts In-Stock

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Semicontronic

India . 526 parts In-Stock

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$443.000

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$431.925

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$429.710

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Ampacity Inc.

Singapore . 181 parts In-Stock

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$455.000

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One Stop Electronics

USA . 1,344 parts In-Stock

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UNI Independent Distributors

Spain . 5,195 parts In-Stock

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Bastille Electronics

Australia . 4,667 parts In-Stock

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Argo Parts USA

USA . 3,412 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 464 parts In-Stock

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Schahn Electronic Components

Germany . 135 parts In-Stock

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Advanced Electronics

New Zealand . 97 parts In-Stock

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Overview

Elevate your telecom systems with the SA5224D by NXP Semiconductors, a top-tier manufacturer known for quality and innovation. This small outline IC offers unparalleled performance in telecom interface applications, ensuring seamless connectivity and reliable operation. With a nominal supply voltage of 5V and industrial-grade temperature tolerance, this product delivers exceptional value and benefits to customers seeking efficiency and durability. Upgrade your systems today with the SA5224D and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly.

Power Supplies (V): 5

Operates at a standard voltage of 5V, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high temperature environments, ensuring reliable performance.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and facilitate easy soldering during assembly.

Technical Specifications

Other Function Telecom Interface ICs SA5224D attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.035 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SA5224D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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