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S9S08DN16F2CLF

NXP Semiconductors

S9S08DN16F2CLF by NXP Semiconductors

MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; ADC Channels: YES;

Median Price

$5.700

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,888 parts In-Stock

1+ parts

-

100+ parts

$4.920

1k+ parts

$4.400

10k+ parts

$4.140

2,888

-

$4.920

$4.400

$4.140

DigiKey

USA . 2,888 parts In-Stock

1+ parts

-

100+ parts

$6.480

1k+ parts

-

10k+ parts

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2,888

-

$6.480

-

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Verical

USA . 590 parts In-Stock

1+ parts

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590

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Avnet

USA . 250 parts In-Stock

1+ parts

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250

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,935 parts In-Stock

1+ parts

$4.712

100+ parts

-

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-

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3,935

$4.712

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Vyrian

USA . 2,937 parts In-Stock

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2,937

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TME

Poland . 250 parts In-Stock

1+ parts

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$6.600

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250

-

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$6.600

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Anansix

USA . 71 parts In-Stock

1+ parts

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71

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 872 parts In-Stock

1+ parts

$4.464

100+ parts

-

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10k+ parts

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872

$4.464

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Vigor

Singapore . 10,000 parts In-Stock

1+ parts

$7.398

100+ parts

-

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10k+ parts

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10,000

$7.398

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Microchip USA

USA . 1,345 parts In-Stock

1+ parts

$16.971

100+ parts

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1,345

$16.971

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AZTECH Wire

Italy . 274 parts In-Stock

1+ parts

$17.710

100+ parts

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274

$17.710

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Advanced Electronics

New Zealand . 1,500 parts In-Stock

1+ parts

$49.552

100+ parts

$49.057

1k+ parts

$47.075

10k+ parts

-

1,500

$49.552

$49.057

$47.075

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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UNI Independent Distributors

Spain . 987 parts In-Stock

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987

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Technical Specifications

Microcontrollers S9S08DN16F2CLF attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

40 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

S9S08DN16F2CLF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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