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S9S08QD4J1MSC,574

NXP Semiconductors

S9S08QD4J1MSC,574 by NXP Semiconductors

NXP Semiconductors' S9S08QD4J1MSC,574 microcontroller features 8-bit size, 4 MHz clock frequency, and AEC-Q100 screening level. Ideal for automotive applications due to its small outline package style, PWM channels, and ADC channels for precise control in a compact design.

Median Price

$1.200

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 392 parts In-Stock

1+ parts

$1.200

100+ parts

$1.180

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$1.150

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392

$1.200

$1.180

$1.150

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Distributors (In-Stock)

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Digiode

USA . 1,673 parts In-Stock

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$1.140

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1,673

$1.140

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Vyrian

USA . 7,835 parts In-Stock

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7,835

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Anansix

USA . 416 parts In-Stock

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416

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 274 parts In-Stock

1+ parts

$1.020

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274

$1.020

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Corphita

USA . 2,583 parts In-Stock

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$1.080

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2,583

$1.080

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Microchip USA

USA . 1,893 parts In-Stock

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$1.358

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1,893

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AZTECH Wire

Italy . 629 parts In-Stock

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$6.658

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629

$6.658

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Vigor

Singapore . 4,250 parts In-Stock

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Argo Parts USA

USA . 4,242 parts In-Stock

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Bastille Electronics

Australia . 3,624 parts In-Stock

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UNI Independent Distributors

Spain . 1,318 parts In-Stock

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Continental Prestige Electronics

USA . 865 parts In-Stock

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Overview

Looking for a superior microcontroller for your next project? Look no further than the S9S08QD4J1MSC,574 by NXP Semiconductors. With top-notch quality and reliability from a trusted manufacturer, this microcontroller is perfect for a wide range of applications. From automotive to industrial automation, this product offers unmatched value, benefits, and advantages to customers looking for high-performance solutions. Upgrade your designs with the S9S08QD4J1MSC,574 and experience the difference today!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides a good balance of durability and cost-effectiveness.

Surface Mount

YES - Allows for easy integration onto a PCB, saving space and simplifying assembly processes.

Maximum Supply Voltage

5.5 V - Provides flexibility for use in various power supply setups.

Screening Level

AEC-Q100 - Ensures reliability and quality standards for automotive applications.

Package Shape

RECTANGULAR - Enables efficient use of board space and easy placement in designs.

Bit Size

8 - Suitable for handling a wide range of general-purpose tasks.

No. of Terminals

8 - Offers enough connectivity options for typical microcontroller applications.

Package Style (Meter)

SMALL OUTLINE - Fits well in compact designs and space-constrained environments.

Minimum Supply Voltage

2.7 V - Supports operation in low-power scenarios and extends battery life.

ADC Channels

YES - Allows for analog sensor integration and data capture.

Terminal Position

DUAL - Provides flexibility in PCB layout and routing options.

Maximum Seated Height

1.75 mm - Helps in maintaining a slim profile for space-constrained applications.

Width

3.9 mm - Contributes to the overall compactness of the design.

Maximum Clock Frequency

4 MHz - Offers a balance between processing speed and power consumption.

Length

4.9 mm - Contributes to the overall small form factor of the microcontroller.

Peripheral IC Type

MICROCONTROLLER - Designed specifically for microcontroller applications, ensuring optimized performance.

Technology

CMOS - Offers low power consumption and high noise immunity.

Terminal Form

GULL WING - Facilitates easy soldering and ensures reliable electrical connections.

Nominal Supply Voltage

3 V - Common operating voltage for many digital circuits, ensuring compatibility.

PWM Channels

YES - Enables precise control and modulation of signals for various applications.

ROM Programmability

FLASH - Allows for flexible and fast reprogramming of the microcontroller.

Terminal Pitch

1.27 mm - Compatible with standard PCB layout practices and facilitates easy integration.

Speed

16 rpm - Adequate processing speed for typical microcontroller applications.

No. of I/O Lines

6 - Offers sufficient input/output capabilities for connecting to external devices and sensors.

Technical Specifications

Microcontrollers S9S08QD4J1MSC,574 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

4 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of I/O Lines:

6

No. of Terminals:

8

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Speed:

16 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

S9S08QD4J1MSC,574 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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