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PSMN011-30YL,115

NXP Semiconductors

PSMN011-30YL,115 by NXP Semiconductors

PSMN011-30YL,115 by NXP Semiconductors is a single N-channel MOSFET designed for high-efficiency applications. It supports a max drain current of 51 A and power dissipation of 49 W, operating up to 175 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,698 parts In-Stock

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Digiode

USA . 3,341 parts In-Stock

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Anansix

USA . 2,421 parts In-Stock

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One Stop Electronics

USA . 393 parts In-Stock

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$0.050

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AZTECH Wire

Italy . 690 parts In-Stock

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$19.080

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690

$19.080

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Ampacity Inc.

Singapore . 384 parts In-Stock

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$38.050

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UNI Independent Distributors

Spain . 6,914 parts In-Stock

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Corphita

USA . 1,708 parts In-Stock

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Overview

Unlock exceptional performance with the PSMN011-30YL,115 from NXP Semiconductors, a leader in innovative electronic solutions. This N-channel Power FET is designed for reliability and efficiency, making it perfect for demanding applications like power management and motor control. With robust thermal characteristics and a compact surface-mount design, this transistor ensures long-lasting performance while simplifying circuit layouts—empowering your projects with unmatched quality and dependability.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide lower on-resistance and higher efficiency, making them ideal for high-speed switching applications.

Configuration: SINGLE

Single configuration offers simplicity in design, reducing the footprint and complexity for efficient circuit integration.

Surface Mount: YES

Surface mount technology allows for more compact designs and better thermal performance, facilitating high-density assembly in modern electronics.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are known for their high input impedance and low power consumption, making them suitable for low-power applications.

Maximum Drain Current (Abs) (ID): 51 A

With a maximum drain current of 51 A, this FET can handle high loads, perfect for power applications requiring robust performance.

Maximum Power Dissipation (Abs): 49 W

A power dissipation rating of 49 W ensures that this FET can operate efficiently without overheating, enhancing reliability in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high-speed operation and low power consumption, making it ideal for modern digital and analog circuits.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature of 175 °C allows this FET to function in harsh conditions, expanding its application range.

Terminal Finish: TIN

Tin terminal finish provides excellent solderability and corrosion resistance, ensuring long-lasting reliability in electronic assemblies.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds makes this FET compatible with standard soldering processes for dependable assembly in production.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures that this FET can withstand modern PCB assembly techniques without damage, ensuring its integrity in high-temperature soldering.

Technical Specifications

Power Field Effect Transistors (FET) PSMN011-30YL,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

51 A

Maximum Drain Current (ID):

51 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PSMN011-30YL,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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