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PIP3115-B

NXP Semiconductors

PIP3115-B by NXP Semiconductors

NXP Semiconductors' PIP3115-B is a peripheral driver with built-in protections for transient, over current, and over voltage. It has a nominal voltage of 13V and turn-on time of 20µs. This rectangular-shaped device in small outline package style is ideal for applications requiring sink output current flow direction.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 4,681 parts In-Stock

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Digiode

USA . 795 parts In-Stock

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Anansix

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Nova Conductors

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Corohmni

South Africa . 1,196 parts In-Stock

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Advanced Electronics

New Zealand . 1,500 parts In-Stock

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$1.326

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One Stop Electronics

USA . 428 parts In-Stock

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$28.500

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Ampacity Inc.

Singapore . 886 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Corphita

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Overview

Enhance your electronic projects with the PIP3115-B by NXP Semiconductors, a top-tier manufacturer known for quality and reliability. As a peripheral driver, this compact device offers built-in protections against transient, over current, over voltage, and thermal issues. With a nominal supply voltage of 13V and quick turn-on/off times, it is ideal for a wide range of applications. Experience seamless performance and peace of mind with the PIP3115-B, the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, making this peripheral driver reliable for long-term use.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The multiple built-in protections ensure the safety of the connected devices by preventing damage from transient spikes, over current, over voltage, and thermal issues.

Nominal Supply Voltage: 13 V

With a nominal supply voltage of 13V, this peripheral driver is suitable for a wide range of applications that require this specific voltage.

Maximum Seated Height: 4.5 mm

The low maximum seated height of 4.5 mm allows for a compact and space-saving design, making it ideal for applications where space is limited.

Turn-on Time: 20 us

The fast turn-on time of 20 microseconds ensures quick and efficient operation of the peripheral driver, reducing delays in the connected system.

Output Current Flow Direction: SINK

The sink output current flow direction allows the peripheral driver to sink current from connected devices, providing a reliable and stable operation for the entire system.

Technical Specifications

Peripheral Drivers PIP3115-B attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

4.5 mm

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Turn-off Time:

70 us

Turn-on Time:

20 us

Trade Compliance

PIP3115-B Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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