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PHP29N08T,127

NXP Semiconductors

PHP29N08T,127 by NXP Semiconductors

NXP Semiconductors' PHP29N08T,127 is a N-CHANNEL FET with 75V DS breakdown voltage and 108A IDM. Ideal for switching applications, it has a max power dissipation of 88W and 0.05 ohm RDS(on). The transistor operates in enhancement mode with a max temp of 175°C.

Median Price

$1.130

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,027 parts In-Stock

1+ parts

$0.800

100+ parts

$0.688

1k+ parts

$0.613

10k+ parts

-

3,027

$0.800

$0.688

$0.613

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Rochester

USA . 24,178 parts In-Stock

1+ parts

-

100+ parts

$1.460

1k+ parts

$1.210

10k+ parts

$1.080

24,178

-

$1.460

$1.210

$1.080

DigiKey

USA . 24,178 parts In-Stock

1+ parts

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$1.830

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24,178

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$1.830

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Verical

USA . 13,156 parts In-Stock

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$1.512

10k+ parts

$1.350

13,156

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$1.512

$1.350

Arrow

USA . 1,878 parts In-Stock

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$0.452

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1,878

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$0.452

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Chip1Stop

Japan . 80 parts In-Stock

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$0.451

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80

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$0.451

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Digiode

USA . 2,512 parts In-Stock

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$0.582

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2,512

$0.582

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Chip Stock

USA . 91,000 parts In-Stock

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91,000

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DigiKey Marketplace

USA . 24,178 parts In-Stock

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$0.640

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24,178

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$0.640

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Vyrian

USA . 3,119 parts In-Stock

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Anansix

USA . 76 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 12,626 parts In-Stock

1+ parts

$0.383

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12,626

$0.383

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Corphita

USA . 4,375 parts In-Stock

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$0.552

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$0.552

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AZTECH Wire

Italy . 8,595 parts In-Stock

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$0.650

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$0.650

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Corohmni

South Africa . 268 parts In-Stock

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$1.672

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268

$1.672

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Microchip USA

USA . 6,265 parts In-Stock

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$9.945

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6,265

$9.945

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Lixinc

USA . 18,933 parts In-Stock

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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UNI Independent Distributors

Spain . 7,415 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,138 parts In-Stock

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Robosynatics

Brazil . 3,313 parts In-Stock

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Lucentia Tech

USA . 3,313 parts In-Stock

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$0.996

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$0.975

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$0.975

3,313

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$0.975

Continental Prestige Electronics

USA . 3,099 parts In-Stock

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Andel Nordic

Denmark . 1,571 parts In-Stock

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Supply Digital

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Kepictronics

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Argo Parts USA

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock the power of efficient switching with the PHP29N08T,127 by NXP Semiconductors. Crafted with precision and reliability, this Power FET is designed for seamless performance in various applications. Whether you're looking to optimize your electronic system or enhance your project's capabilities, this N-CHANNEL transistor with a built-in diode offers value, benefits, and advantages that will elevate your experience. Embrace quality and innovation with NXP Semiconductors and revolutionize the way you work with the PHP29N08T,127.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good thermal and electrical insulation properties, ensuring better reliability and safety.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can protect against reverse voltage spikes, making this FET convenient and versatile for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance, optimizing performance in power control applications.

Maximum Pulsed Drain Current (IDM): 108 A

With a high maximum pulsed drain current, this FET can handle sudden spikes in current demands, making it suitable for applications that require high power handling capabilities.

Maximum Power Dissipation (Abs): 88 W

The high maximum power dissipation allows for efficient heat dissipation, enabling the FET to operate at high power levels without overheating.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperature environments, ensuring reliable performance in harsh conditions.

Maximum Drain-Source On Resistance: 0.05 ohm

The low on-resistance of the FET results in minimal power loss and efficient power conversion, making it a suitable choice for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) PHP29N08T,127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

108 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PHP29N08T,127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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