Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PESD3V3S2UT,215 by NXP Semiconductors is a Transient Suppression Device with 330W peak power dissipation, 5.6V breakdown voltage, and 150°C max operating temp. Commonly used for surge protection in electronic circuits due to its avalanche technology and unidirectional polarity.
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Supply Digital
Plastic/epoxy material provides durability and protection, making the device suitable for various environments and applications.
Common anode configuration with 2 elements allows for efficient and effective transient suppression, enhancing the overall performance of the device.
Surface mount capability enables easy and convenient installation, saving time and effort during assembly.
High peak reverse power dissipation capacity ensures reliable protection of electronic components from transient voltage spikes.
The nominal breakdown voltage of 5.6V provides the necessary protection levels for sensitive circuits and components.
Rectangular package shape allows for easy integration and placement within circuit designs.
Three terminals provide stable and secure connection points for reliable performance.
Small outline package style saves space on the PCB, ideal for compact electronic devices.
High maximum operating temperature tolerance ensures the device can withstand harsh environmental conditions.
Tin terminal finish offers excellent conductivity and corrosion resistance for long-term reliability.
Dual terminal position provides flexibility in circuit designs and installations.
The minimum breakdown voltage of 5.2V ensures effective transient suppression for lower voltage applications.
Short reflow time of 30s minimizes heat exposure, reducing the risk of thermal damage during soldering processes.
High peak reflow temperature tolerance of 260°C ensures the device can withstand reflow soldering without degradation.
The maximum breakdown voltage of 6V provides an additional safety margin for transient voltage protection.
Trans voltage suppressor diode type is specifically designed for transient suppression applications, ensuring optimal performance.
Avalanche technology offers robust and reliable performance in suppressing transient voltage spikes.
Gull wing terminal form provides secure and stable mounting on the PCB for enhanced durability.
Two elements provide dual protection for sensitive components, enhancing the overall efficiency of the device.
High maximum repetitive peak reverse voltage ensures continuous protection against voltage spikes in the circuit.
Unidirectional polarity allows for effective suppression of transient voltage spikes in one direction, ensuring proper circuit functionality.
Silicon diode element material offers high reliability and stability in transient suppression applications.
Transient Suppression Devices PESD3V3S2UT,215 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors
Maximum Breakdown Voltage:
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JEDEC-95 Code:
JESD-30 Code:
JESD-609 Code:
Moisture Sensitivity Level (MSL):
Maximum Non Repetitive Peak Reverse Power Dissipation:
No. of Elements:
No. of Terminals:
Maximum Operating Temperature:
Package Body Material:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Polarity:
Qualification:
Maximum Repetitive Peak Reverse Voltage:
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PESD3V3S2UT,215 Diodes trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8541.10.00.50
SB
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
2N2222A
Allegro MicroSystems
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Infineon Technologies
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
1N4148
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
M24308/2-1F
Souriau
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Body or Shell Style: RECEPTACLE; MIL Conformity: YES;
Daco Semiconductor
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Eic Semiconductor
Onsemi
1N4148WS
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
TPSMB33CA
Meritek Electronics
P6KE24A
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 20.5 V; Nominal Breakdown Voltage: 24 V; Maximum Clamping Voltage: 33.2 V; Polarity: UNIDIRECTIONAL;
SMAJ12CA
Db Lectro
SMBJ24A
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 24 V; Nominal Breakdown Voltage: 28.1 V; Polarity: UNIDIRECTIONAL; Maximum Clamping Voltage: 38.5 V;
P6KE51A
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ30CA
Leshan Radio
5KP33A
Secos
Lite-on Semiconductor
World Products
Yangzhou Yangjie Electronics
SMAJ5.0A
Goodwork Semiconductor
SMBJ36CA
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 58.1 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 42.1 V; Maximum Repetitive Peak Reverse Voltage: 36 V;
Eris Technology
SMBJ5.0A
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: UNIDIRECTIONAL; Nominal Breakdown Voltage: 6.735 V; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 5 V;
SMAJ33CA
Diotec Electronics
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 14 V; Maximum Repetitive Peak Reverse Voltage: 12 V; Maximum Clamping Voltage: 19.9 V; Polarity: BIDIRECTIONAL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
PESD1CAN-UX
Nexperia
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
PESD1CAN-UX by NXP Semiconductors is a transient suppression device with 2 common cathode elements. It has a max non-repetitive peak reverse power dissipation of 150W and breakdown voltage of 27.8V. Ideal for protecting CAN bus interfaces in automotive applications, it operates b/w -55°C to 150°C temperature range.
PESD1CAN,215
PESD1CAN,215 by NXP Semiconductors is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with 27.8V breakdown voltage and 200W peak power dissipation. It is designed for transient suppression in automotive CAN bus systems, offering a max clamping voltage of 70V.
PESD3V3S2UT,215
PESD2CAN,215
PESD2CAN,215 by NXP Semiconductors is a single transient suppression device with 230W peak power dissipation and 28V breakdown voltage. Ideal for protecting CAN bus systems in automotive applications due to its bidirectional polarity, 41V clamping voltage, and silicon diode element material.
PESD1CANVL
PESD1CANVL by Nexperia is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max breakdown voltage of 30.3V. It has a package style of SMALL OUTLINE and can handle a max non-repetitive peak reverse power dissipation of 200W. This device is commonly used for transient suppression in applications such as automotive CAN bus systems.
PESD1CAN-U
PESD1CAN-U by NXP Semiconductors is a transient suppression device with common cathode configuration and 2 elements. It has a max non-repetitive peak reverse power dissipation of 150W, making it suitable for protecting CAN bus systems in automotive applications. With a breakdown voltage range of 25.4V to 30.3V, this diode offers bidirectional protection against voltage spikes.
PESD1CAN-T7
Protek Devices
PESD1CAN-T7 by Protek Devices is a transient suppression device with 2 elements, common cathode config, and 200W peak reverse power dissipation. Ideal for protecting CAN bus systems in automotive applications due to its bidirectional polarity and 24V max repetitive peak reverse voltage.
PESD1CANT/R
PESD1CANT/R by NXP Semiconductors is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a breakdown voltage of 27.8V and max clamping voltage of 70V. It is surface mountable and designed for applications requiring protection against transient voltage spikes up to 24V in both directions.
PESD5V0L1BA,115
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
PESD5V0L1BA,115 by NXP Semiconductors is a single bidirectional transient suppression device with a max power dissipation of 500W. It operates at a breakdown voltage of 7.6V and has a max clamping voltage of 33V. This device is ideal for protecting sensitive electronics from voltage spikes in various applications.
PESD3V3S1UB,115
PESD3V3S1UB,115 by NXP Semiconductors is a single avalanche diode with a breakdown voltage of 5.6 V and max clamping voltage of 20 V. It is designed for transient suppression applications in electronics to protect against voltage spikes and surges. This surface-mount device has a max operating temperature of 150°C, making it suitable for various industrial and consumer electronic products.
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
PESD1CAN
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 27.8 V; Maximum Repetitive Peak Reverse Voltage: 24 V; Maximum Clamping Voltage: 70 V; Polarity: BIDIRECTIONAL;
PESD3V3-T73
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