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PCU9956ATW/S911Y

NXP Semiconductors

PCU9956ATW/S911Y by NXP Semiconductors

PCU9956ATW/S911Y by NXP Semiconductors is a graphics display driver designed for industrial applications. It operates at 3.3/5V, features a compact 38-terminal gull-wing package, and withstands temperatures from -40 °C to 85 °C. Ideal for surface mount technology in demanding environments.

Median Price

$1.359

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 17,394 parts In-Stock

1+ parts

-

100+ parts

$1.280

1k+ parts

$1.150

10k+ parts

$1.080

17,394

-

$1.280

$1.150

$1.080

Verical

USA . 17,394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.438

10k+ parts

$1.350

17,394

-

-

$1.438

$1.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,862 parts In-Stock

1+ parts

$1.358

100+ parts

-

1k+ parts

-

10k+ parts

-

3,862

$1.358

-

-

-

Vyrian

USA . 3,907 parts In-Stock

1+ parts

$1.430

100+ parts

-

1k+ parts

-

10k+ parts

-

3,907

$1.430

-

-

-

Anansix

USA . 1,607 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,607

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,905 parts In-Stock

1+ parts

$1.287

100+ parts

-

1k+ parts

-

10k+ parts

-

2,905

$1.287

-

-

-

UNI Independent Distributors

Spain . 5,744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,744

-

-

-

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Overview

Elevate your graphics display capabilities with the PCU9956ATW/S911Y from NXP Semiconductors. Renowned for its commitment to quality and innovation, NXP delivers a robust driver that excels in diverse applications, ensuring reliable performance in challenging environments. Enjoy seamless integration and superior efficiency, unlocking new possibilities for your designs while benefiting from reduced energy consumption and enhanced visual clarity. Transform your projects with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and provides effective protection against environmental factors, making this driver reliable for various applications.

Surface Mount: YES

Being a surface mount device facilitates compact designs and easy integration into modern circuit boards, ensuring efficient use of space.

Package Shape: RECTANGULAR

The rectangular package shape allows for optimal placement on PCB, ensuring a stable connection and efficient heat dissipation.

Power Supplies (V): 3.3/5

Dual voltage support (3.3V and 5V) offers flexibility for various system designs and simplifies integration into both low-power and higher-power applications.

No. of Terminals: 38

With 38 terminals, this driver provides sufficient connectivity options for advanced functionality and versatile circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it an excellent choice for space-constrained designs while maintaining high performance and functionality.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C indicates high thermal tolerance, making it suitable for industrial and demanding environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this driver is well-suited for applications in harsh conditions and extreme environments.

Terminal Position: DUAL

Dual terminal positioning allows for easier soldering and enhances the reliability of connections, reducing potential operational issues.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures consistent performance under a wide range of temperatures, making it ideal for industrial applications.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and can improve the automation of assembly processes, ensuring robust connections.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for denser component layouts, which is advantageous in modern electronic designs where space efficiency is critical.

Technical Specifications

Graphics Display Drivers PCU9956ATW/S911Y attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G38

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

PCU9956ATW/S911Y Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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