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PCU9655PW1

NXP Semiconductors

PCU9655PW1 by NXP Semiconductors

PCU9655PW1 from NXP Semiconductors is a compact LED display driver designed for industrial applications. It operates b/w 3V and 5.5V, supports serial data input, and functions effectively in temperatures ranging from -40 °C to 85 °C. With 28 terminals and a thin profile, it’s ideal for space-constrained designs.

Median Price

$10.217

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 152 parts In-Stock

1+ parts

$10.217

100+ parts

$10.728

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$10.115

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152

$10.217

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$10.115

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Anansix

USA . 1,847 parts In-Stock

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1,847

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Vyrian

USA . 318 parts In-Stock

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318

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Digiode

USA . 112 parts In-Stock

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112

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One Stop Electronics

USA . 1,592 parts In-Stock

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$11.500

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1,592

$11.500

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,992 parts In-Stock

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Corphita

USA . 2,215 parts In-Stock

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Overview

Elevate your graphics display capabilities with the PCU9655PW1 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a robust solution designed for diverse applications, from industrial controls to consumer electronics. With its compact design and superior performance, this driver ensures crisp visuals and energy efficiency, empowering your projects while enhancing user experience. Trust in NXP's expertise to elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental stress, making the product reliable in various applications.

Data Input Mode: SERIAL

Serial data input allows for efficient communication with microcontrollers and other devices, reducing pin count and simplifying design.

Surface Mount: YES

Being surface mount allows for a smaller footprint on PCBs, facilitating space-efficient designs and improving manufacturing processes.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V provides compatibility with a wide range of power systems while ensuring robust performance.

Package Shape: RECTANGULAR

The rectangular shape of the package enables a more compact arrangement on circuit boards, beneficial for high-density designs.

No. of Terminals: 28

With 28 terminals, this driver can support complex functionality and connectivity while maintaining a manageable size.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style ensures a low profile and space-saving design, ideal for applications where height and weight are constraints.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V allows for operation in lower-voltage applications, enhancing versatility across different product lines.

Maximum Operating Temperature: 85 °C

A max operating temperature of 85 °C ensures reliable performance in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes this driver suitable for extreme environments, increasing its application range.

Terminal Position: DUAL

Dual terminal positions facilitate easier PCB layout and design, providing flexibility in integrating the driver into existing systems.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1mm contributes to a slimmer profile which is advantageous in compact device designs.

Width: 4.4 mm

The narrow width is perfect for tight spaces in electronic devices, allowing for efficient use of real estate on PCBs.

Length: 9.7 mm

A compact length enhances the feasibility of integrating this driver into various applications without compromising space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ratings ensure reliability and longevity in demanding conditions, suitable for industrial and automotive applications.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connections and are easier to solder, improving manufacturing efficiency.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V aligns well with modern digital circuits, ensuring compatibility and reducing power consumption.

No. of Segments: 16

With 16 segments, this display driver supports a variety of display configurations, offering flexibility for different design needs.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65mm allows for more compact placement of components with improved manufacturability for high-density PCBs.

Minimum fmax: 5 MHz

A minimum frequency of 5 MHz ensures that the driver can handle fast data rates, making it suitable for high-performance applications.

Moisture Sensitivity Level (MSL): 2

An MSL level of 2 indicates that the product is moderately sensitive to moisture, making it suitable for indoor and controlled environments.

Interface IC Type: LED DISPLAY DRIVER

As an LED display driver, it caters specifically to applications needing precise control over LED segments, making it ideal for displays.

Technical Specifications

Graphics Display Drivers PCU9655PW1 attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Minimum fmax:

5 MHz

Trade Compliance

PCU9655PW1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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