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PCK2002PD,112

NXP Semiconductors

PCK2002PD,112 by NXP Semiconductors

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,219

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-

-

-

Digiode

USA . 3,533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,533

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-

-

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Anansix

USA . 1,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,031

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,931 parts In-Stock

1+ parts

$3.130

100+ parts

-

1k+ parts

$2.192

10k+ parts

$2.192

3,931

$3.130

-

$2.192

$2.192

AZTECH Wire

Italy . 672 parts In-Stock

1+ parts

$14.450

100+ parts

-

1k+ parts

-

10k+ parts

-

672

$14.450

-

-

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One Stop Electronics

USA . 189 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

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10k+ parts

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189

$29.000

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Microchip USA

USA . 495 parts In-Stock

1+ parts

$44.965

100+ parts

-

1k+ parts

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10k+ parts

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495

$44.965

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UNI Independent Distributors

Spain . 6,089 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,089

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Corphita

USA . 506 parts In-Stock

1+ parts

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100+ parts

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506

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Technical Specifications

Clock Drivers & Buffers PCK2002PD,112 attributes and parameters. Explore more Clock Drivers & Buffers devices from NXP Semiconductors

Specs

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.4 ns

Propagation Delay (tpd):

3.4 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

533 MHz

Trade Compliance

PCK2002PD,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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