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PCF8566P,112

NXP Semiconductors

PCF8566P,112 by NXP Semiconductors

LIQUID CRYSTAL DISPLAY DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,320

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-

-

-

Digiode

USA . 2,594 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,594

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-

-

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Anansix

USA . 1,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,036

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 285 parts In-Stock

1+ parts

$2.025

100+ parts

-

1k+ parts

-

10k+ parts

-

285

$2.025

-

-

-

One Stop Electronics

USA . 806 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

806

$4.500

-

-

-

AZTECH Wire

Italy . 991 parts In-Stock

1+ parts

$21.460

100+ parts

-

1k+ parts

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10k+ parts

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991

$21.460

-

-

-

UNI Independent Distributors

Spain . 8,104 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,104

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Corphita

USA . 1,921 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,921

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Perfect Parts

USA . 22 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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22

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Cyclops Electronics Ltd (Excess)

UK . 10 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10

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Technical Specifications

Graphics Display Drivers PCF8566P,112 attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDIP-T40

JESD-609 Code:

e3

Length:

52 mm

Multiplexed Display Capability:

YES

No. of Backplanes:

4-BP

No. of Digits/Characters:

12-DIGIT

No. of Functions:

1

No. of Segments:

24

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.09 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

3.5 V

Minimum Supply Voltage-1:

-3.5 V

Nominal Supply Voltage-1:

3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Minimum fmax:

.315 MHz

Trade Compliance

PCF8566P,112 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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