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PCF85063TP/1,118

NXP Semiconductors

PCF85063TP/1,118 by NXP Semiconductors

PCF85063TP/1,118 by NXP Semiconductors is a SERIAL 2 WIRE/I2C RTC with 8 terminals. Operating temperature range from -40 to 85 °C makes it suitable for industrial applications. This CMOS technology device has a small outline package and is surface mountable.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 973 parts In-Stock

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Anansix

USA . 607 parts In-Stock

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Digiode

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Nova Conductors

Japan . 67 parts In-Stock

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Semicontronic

India . 752 parts In-Stock

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$6.000

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$5.850

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$5.820

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AZTECH Wire

Italy . 55 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 2,184 parts In-Stock

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Aztec Data Supply Inc.

USA . 292 parts In-Stock

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$48.490

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UNI Independent Distributors

Spain . 7,968 parts In-Stock

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Continental Prestige Electronics

USA . 4,643 parts In-Stock

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Argo Parts USA

USA . 3,048 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Upgrade your devices with the advanced PCF85063TP/1,118 by NXP Semiconductors! This high-quality timer and real-time clock offers unparalleled precision and reliability, thanks to NXP's cutting-edge technology. Perfect for a wide range of applications, this product ensures accurate timekeeping and seamless operation. With easy access methods and a compact design, it's the perfect choice for any project. Trust NXP Semiconductors to deliver superior performance and value with the PCF85063TP/1,118.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to minor impacts, making it a reliable choice for various applications.

Information Access Method: SERIAL, 2 WIRE/I2C

The serial and I2C access methods make it easy to interface with other devices, allowing for seamless communication and integration within a system.

Surface Mount: YES

Being surface mountable, this product offers easy installation and saves space on a PCB, making it suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape provides versatility in placement and mounting options, ensuring compatibility with different design layouts.

Power Supplies (V): 1.2/5

With support for multiple power supply voltages, this product offers flexibility in operation and can be utilized in a variety of voltage environments.

No. of Terminals: 8

Having 8 terminals allows for connection to various other components, increasing the functionality and versatility of the product.

Interrupt Capability: N

The lack of interrupt capability may indicate a simpler design, which can be beneficial for applications that do not require complex interrupt handling.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on a PCB and can be advantageous for designs where size and layout efficiency are crucial.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C ensures reliable performance in harsh environmental conditions without risk of overheating.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is suitable for use in cold environments or applications that require a wide temperature range.

Terminal Position: DUAL

The dual terminal position offers flexibility in connection options, allowing for various wiring configurations to suit different design requirements.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product meets the temperature and durability requirements of industrial applications, ensuring reliable operation in demanding environments.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy electrical environments.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation process and reduces the risk of soldering errors during assembly, improving the overall reliability of the product.

Minimum Time: SECONDS

Having the capability to measure time in seconds allows for precise timekeeping and event scheduling, making this product suitable for applications that require accurate timing functions.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm enables high-density mounting on a PCB, increasing design flexibility and compatibility with compact electronic devices.

Volatile: YES

Being volatile means that the data stored in the product is lost when power is removed, which can be advantageous for applications that require temporary storage or real-time processing.

Technical Specifications

Timers & Real-Time Clocks PCF85063TP/1,118 attributes and parameters. Explore more Timers & Real-Time Clocks devices from NXP Semiconductors

Specs

Information Access Method:

SERIAL, 2 WIRE/I2C

Interrupt Capability:

N

JESD-30 Code:

R-PDSO-N8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.2/5

Qualification:

Not Qualified

Sub-Category:

Timers or RTCs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Volatile:

YES

Trade Compliance

PCF85063TP/1,118 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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