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PCA9614DP,118

NXP Semiconductors

PCA9614DP,118 by NXP Semiconductors

PCA9614DP,118 from NXP is a versatile interface IC designed for industrial applications. It operates b/w 2.3V and 5.5V with a max temp of 85 °C, featuring a compact 10-terminal gull-wing package. Ideal for surface mount designs, it ensures reliable communication in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 3,942 parts In-Stock

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Digiode

USA . 3,650 parts In-Stock

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Anansix

USA . 117 parts In-Stock

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117

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Prism Electronics

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Vigor

Singapore . 3,866 parts In-Stock

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$3.130

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AZTECH Wire

Italy . 202 parts In-Stock

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One Stop Electronics

USA . 657 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,001 parts In-Stock

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UNI Independent Distributors

Spain . 7,836 parts In-Stock

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Microchip USA

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Perfect Parts

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Corphita

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Overview

Unlock seamless connectivity with the PCA9614DP,118 from NXP Semiconductors, a trusted leader in innovative solutions. This high-performance interface IC enhances communication efficiency in industrial applications, ensuring reliability even in extreme temperatures. With its compact design and robust features, this versatile component simplifies system integration, offering exceptional value for engineers seeking quality and performance. Experience the difference with NXP—where excellence meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating easier integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this IC is versatile for various voltage-sensitive applications.

Package Shape: SQUARE

The square package shape helps optimize board space, making it ideal for dense circuit designs.

No. of Terminals: 10

Ten terminals provide ample connectivity options for diverse applications, enhancing functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for efficient space utilization on PCB, an important factor in compact device design.

Minimum Supply Voltage: 2.3 V

A minimum supply voltage of 2.3 V enables the IC to function effectively in battery-powered applications, enhancing flexibility.

Maximum Operating Temperature: 85 °C

Operating at temperatures up to 85 °C makes this IC suitable for industrial environments where heat is a consideration.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this IC suitable for harsh environments, ensuring reliability in extreme conditions.

Terminal Position: DUAL

Dual terminal positioning simplifies circuit layout and improves soldering performance during assembly.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1 mm contributes to a sleek profile, making this component ideal for space-constrained applications.

Width: 3 mm

The compact width enhances the IC's compatibility with small form factor designs.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C ensures compatibility with modern soldering processes, aiding in reliable assembly.

Length: 3 mm

At a length of 3 mm, this IC supports compact design considerations while maintaining functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC is built to last in rigorous conditions, providing long-term reliability.

Terminal Form: GULL WING

Gull wing terminals improve soldering reliability and offer better mechanical stability on the PCB.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this IC is optimized for low power consumption applications.

Nominal Supply Voltage-1: 5 V

The option for a 5 V nominal supply allows flexibility for designs that require higher voltage operations.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit type, this IC is essential for communication between different components in electronic systems.

Technical Specifications

Other Function Interface ICs PCA9614DP,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G10

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

PCA9614DP,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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