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PCA9541AD/03,112

NXP Semiconductors

PCA9541AD/03,112 by NXP Semiconductors

PCA9541AD/03,112 by NXP is a CMOS bus controller ideal for I2C applications. It operates b/w 2.3V and 5.5V, with a max temp of 85 °C and features a compact 16-terminal SO package. Perfect for industrial environments requiring reliable data communication.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,312 parts In-Stock

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Digiode

USA . 3,769 parts In-Stock

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Anansix

USA . 2,854 parts In-Stock

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2,854

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Microchip USA

USA . 427 parts In-Stock

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$8.699

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427

$8.699

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AZTECH Wire

Italy . 932 parts In-Stock

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$15.500

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932

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One Stop Electronics

USA . 1,251 parts In-Stock

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$19.000

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Corohmni

South Africa . 722 parts In-Stock

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$71.395

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722

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Corphita

USA . 4,326 parts In-Stock

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UNI Independent Distributors

Spain . 1,164 parts In-Stock

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Overview

Unlock seamless communication in your designs with the PCA9541AD/03,112 from NXP Semiconductors. Renowned for its exceptional quality and reliability, this bus controller enhances system efficiency across a myriad of applications—from industrial automation to consumer electronics. With its compact design and robust performance, it empowers engineers to streamline connectivity and optimize functionality, ensuring you stay ahead in today's competitive market. Elevate your projects with NXP’s commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable and lightweight plastic/epoxy materials ensures good protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs, enabling integration into modern PCB layouts, saving space and improving performance.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the product can accommodate more demanding applications, providing flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape enhances compatibility with different PCB layouts and optimizes space utilization.

No. of Terminals: 16

Having 16 terminals offers multiple connection options, ensuring that the controller can interface with various devices efficiently.

Package Style (Meter): SMALL OUTLINE

The small outline design reduces the footprint, making it ideal for space-constrained applications.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage expands its usability in low-power applications, promoting energy efficiency.

Maximum Operating Temperature: 85 °C

Operating at high temperatures makes this product suitable for industrial environments where thermal stability is critical.

Minimum Operating Temperature: -40 °C

With an extensive temperature tolerance, this controller is capable of operating in extreme cold conditions, enhancing its versatility.

Terminal Position: DUAL

Dual terminal positioning facilitates easier connections and potentially enhances performance in certain applications.

Maximum Seated Height: 1.75 mm

A low profile design allows for better integration into tight spaces and improves overall device aesthetics.

Width: 3.9 mm

A narrow width enables compatibility with various board designs, making it adaptable for different applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures that the product can withstand modern soldering processes without damage.

Length: 9.9 mm

The compact length of 9.9 mm supports integration into smaller devices while maintaining functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product ensures reliability and durability under harsh conditions.

Peripheral IC Type: BUS CONTROLLER, I2C

As a bus controller for I2C, it facilitates communication between multiple devices, essential for complex systems.

Technology: CMOS

Utilizing CMOS technology enables low power consumption and high-speed operation, making it efficient for modern applications.

Terminal Form: GULL WING

Gull wing terminals allow for efficient soldering and improved electrical connections, enhancing product reliability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V aligns with common logic levels in digital systems, ensuring compatibility and integration ease.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard in many applications, making it easy to work with in design and assembly.

Technical Specifications

Bus Controllers PCA9541AD/03,112 attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

PCA9541AD/03,112 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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