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PCA9512BDP,118

NXP Semiconductors

PCA9512BDP,118 by NXP Semiconductors

PCA9512BDP,118 from NXP Semiconductors is a versatile interface IC designed for industrial applications. It operates b/w 2.7V and 5.5V with a max current of 3.6mA, featuring an 8-terminal gull-wing package. Its robust temperature range (-40 °C to 85 °C) ensures reliability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,029 parts In-Stock

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Anansix

USA . 2,251 parts In-Stock

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Vyrian

USA . 2,215 parts In-Stock

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One Stop Electronics

USA . 1,586 parts In-Stock

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$0.500

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Microchip USA

USA . 102 parts In-Stock

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$6.045

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AZTECH Wire

Italy . 153 parts In-Stock

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$16.390

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Component Stockers USA

USA . 678 parts In-Stock

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$99.990

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UNI Independent Distributors

Spain . 5,619 parts In-Stock

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Corphita

USA . 4,551 parts In-Stock

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Perfect Parts

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Overview

Elevate your designs with the PCA9512BDP,118 from NXP Semiconductors—the benchmark for reliability in interface ICs. Crafted with precision, this compact solution excels in diverse applications, ensuring seamless data communication even under extreme conditions. Trust NXP's industry-leading expertise for unparalleled quality and performance, giving you peace of mind while driving innovation in your next project. Experience efficiency and adaptability like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier and more compact PCB designs, enabling efficient use of space in modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for various applications while ensuring reliable performance within safe operating limits.

Package Shape: SQUARE

The square package shape is advantageous for board layout and provides optimal space utilization in compact designs.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, this product can be integrated into a wide range of systems.

No. of Terminals: 8

With 8 terminals, it provides sufficient connection points for various functionalities while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for high-density PCB layouts, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures compatibility with low-power devices, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Designed to operate at temperatures up to 85 °C, this product is reliable for industrial applications under thermal stress.

Minimum Operating Temperature: -40 °C

The extreme low-temperature performance makes this interface IC suitable for harsh environments, including outdoor and industrial applications.

Terminal Position: DUAL

Dual terminal position offers design flexibility for routing and connecting in various layouts.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a sleek profile, ideal for modern devices where thickness is a concern.

Width: 3 mm

A compact width ideal for fitting into tight spaces in electronic assemblies.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for a manageable thermal profile during soldering, which helps protect sensitive components.

Peak Reflow Temperature: 260 °C

The ability to withstand high peak reflow temperatures ensures it can be used in competitive manufacturing processes.

Length: 3 mm

The 3 mm length enhances compatibility with various PCB designs, optimizing space without compromising functionality.

Temperature Grade: INDUSTRIAL

This industrial temperature grade indicates reliable operation in demanding environments.

Terminal Form: GULL WING

The gull wing terminal form provides easy soldering and good mechanical stability on the PCB.

Maximum Supply Current: 3.6 mA

Low supply current minimizes power consumption, making it ideal for battery-operated devices.

Nominal Supply Voltage: 3.3 V

The common nominal supply voltage of 3.3 V fits seamlessly into many electronic circuits, simplifying design.

Terminal Pitch: 0.65 mm

The 0.65 mm pitch allows for high-density designs while maintaining soldering ease and reliability.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, it is tailored for efficient communication between different components in a system, enhancing overall performance.

Technical Specifications

Other Function Interface ICs PCA9512BDP,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

3.6 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

PCA9512BDP,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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