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PCA9509AGM,125

NXP Semiconductors

PCA9509AGM,125 by NXP Semiconductors

PCA9509AGM,125 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage range of 0.8V to 2V. Operating b/w -40°C to 85°C, it's ideal for industrial applications requiring a compact chip carrier package style and surface mount capability.

Median Price

$0.459

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$0.459

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$0.459

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Flip Electronics

USA . 24,000 parts In-Stock

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24,000

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Vyrian

USA . 5,948 parts In-Stock

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Anansix

USA . 403 parts In-Stock

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403

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Digiode

USA . 70 parts In-Stock

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70

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.459

100+ parts

$0.450

1k+ parts

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500

$0.459

$0.450

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AZTECH Wire

Italy . 500 parts In-Stock

1+ parts

$8.326

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500

$8.326

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One Stop Electronics

USA . 1,122 parts In-Stock

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$36.500

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1,122

$36.500

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,481 parts In-Stock

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UNI Independent Distributors

Spain . 1,440 parts In-Stock

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Microchip USA

USA . 471 parts In-Stock

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Overview

Enhance your electronic designs with the PCA9509AGM,125 by NXP Semiconductors. Known for their top-notch quality and innovative solutions, NXP Semiconductors brings you a versatile interface IC that is perfect for a wide range of applications. With its compact size, high reliability, and industrial-grade temperature tolerance, this product offers unmatched value and performance. Whether you're working on consumer electronics or industrial equipment, the PCA9509AGM,125 is sure to meet your needs and exceed your expectations. Unlock new possibilities and streamline your projects with this exceptional component from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring a long lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 2 V

Suitable for a variety of applications without risking damage from exceeding the voltage limit.

Package Shape: SQUARE

A compact shape that helps optimize PCB space and integration in tight layouts.

No. of Terminals: 8

Provides sufficient connection points for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Enables a slim design for compact electronic devices and reduces overall thickness for space-constrained applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, offering versatility in a wide range of operating environments.

Technical Specifications

Other Function Interface ICs PCA9509AGM,125 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PBCC-B8

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

.8 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

PCA9509AGM,125 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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