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PCA24S08DP/DG,118

NXP Semiconductors

PCA24S08DP/DG,118 by NXP Semiconductors

PCA24S08DP/DG,118 by NXP is an industrial-grade EEPROM with a 1Kx8 organization and operates at 3/3.3V. It features I2C control, dual terminals, and offers robust write protection. Ideal for applications requiring reliable data retention in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,086 parts In-Stock

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Vyrian

USA . 2,622 parts In-Stock

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2,622

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Anansix

USA . 2,064 parts In-Stock

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One Stop Electronics

USA . 754 parts In-Stock

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$25.000

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754

$25.000

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Corphita

USA . 3,438 parts In-Stock

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3,438

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UNI Independent Distributors

Spain . 2,735 parts In-Stock

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Overview

Unlock the power of reliability and efficiency with the PCA24S08DP/DG,118 EEPROM from NXP Semiconductors. Renowned for their high-quality solutions, NXP delivers a versatile memory component designed to excel in demanding industrial applications. With robust data retention, flexible write protection, and exceptional endurance, this small footprint device ensures your projects run smoothly while saving space and energy. Experience superior performance that enhances your designs and drives innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material helps protect the chip, ensuring long-term reliability in various environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on PCBs, making it ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape aids in easy placement and efficient packing, optimizing assembly processes in manufacturing.

Power Supplies (V): 3/3.3

Operating at standard voltages like 3V and 3.3V ensures compatibility with a wide range of electronic systems.

No. of Terminals: 8

The 8-terminal configuration provides sufficient connectivity for reliable data transfer while maintaining a compact size.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch design make it suitable for space-constrained applications, enhancing design flexibility.

Maximum Operating Temperature: 85 °C

The ability to operate up to 85 °C is advantageous for industrial applications where higher temperatures may be encountered.

Organization: 1KX8

A 1Kx8 organization allows for efficient data storage and access, ideal for applications requiring moderate memory capacity.

Minimum Operating Temperature: -40 °C

This low temperature range makes the product suitable for harsh environments, ensuring reliability in extreme conditions.

I2C Control Byte: 10101MMR

The specific I2C control byte supports robust communication with microcontrollers, simplifying integration into electronic designs.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and simplifies soldering during PCB assembly.

Write Protection: HARDWARE/SOFTWARE

Flexibility in write protection ensures data integrity and security, making it ideal for critical data storage applications.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications guarantee durability and operational reliability in demanding conditions.

Technology: CMOS

CMOS technology ensures low power consumption while providing high-speed operation, enhancing overall efficiency.

Parallel or Serial: SERIAL

Serial communication minimizes pin count and simplifies wiring, making it an ideal choice for compact designs.

Terminal Form: GULL WING

The gull wing terminal design enhances solder joint reliability and provides easier handling during assembly.

Maximum Supply Current: 1 mA

A low maximum supply current ensures reduced power usage, making the product energy-efficient for battery-operated devices.

No. of Words: 1024 words

With 1024 words of storage, it provides adequate space for a variety of applications while remaining cost-effective.

Memory Width: 8

An 8-bit memory width aligns well with most microcontrollers, facilitating seamless data processing.

Minimum Data Retention Time: 10

A long data retention time ensures stored data remains intact for extended periods, crucial for maintaining firmware and configurations.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm supports high-density mounting, making it suitable for applications with limited space.

No. of Words Code: 1K

A 1K word capacity offers a good balance of memory size and efficiency for various embedded applications.

Endurance: 100000 Write/Erase Cycles

High endurance withstands frequent data updates, making it suitable for applications that require regular changes to data.

Serial Bus Type: I2C

I2C bus compatibility simplifies multi-device connectivity, streamlining designs in complex systems.

Memory Density: 8192 bit

With a memory density of 8192 bits, it provides ample storage capacity for small to medium-sized applications.

Memory IC Type: EEPROM

As an EEPROM, it retains data without power, ideal for storing critical settings in various applications.

Maximum Standby Current: 0.000015 Amp

Extremely low standby current ensures minimal power consumption during idle periods, enhancing energy efficiency.

Technical Specifications

EEPROM PCA24S08DP/DG,118 attributes and parameters. Explore more EEPROM devices from NXP Semiconductors

Specs

Minimum Data Retention Time:

10

Endurance:

100000 Write/Erase Cycles

I2C Control Byte:

10101MMR

JESD-30 Code:

R-PDSO-G8

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Serial Bus Type:

I2C

Maximum Standby Current:

.000015 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

PCA24S08DP/DG,118 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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