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P80C557E4EFB/01,55

NXP Semiconductors

P80C557E4EFB/01,55 by NXP Semiconductors

MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,531 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,531

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Digiode

USA . 926 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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926

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Anansix

USA . 448 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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448

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,018 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,018

$8.000

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AZTECH Wire

Italy . 264 parts In-Stock

1+ parts

$19.930

100+ parts

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1k+ parts

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10k+ parts

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264

$19.930

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Component Stockers USA

USA . 371 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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371

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 21,240 parts In-Stock

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21,240

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Microchip USA

USA . 4,934 parts In-Stock

1+ parts

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4,934

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Corphita

USA . 4,843 parts In-Stock

1+ parts

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4,843

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UNI Independent Distributors

Spain . 2,853 parts In-Stock

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100+ parts

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1k+ parts

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2,853

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Technical Specifications

Microcontrollers P80C557E4EFB/01,55 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

R-PQFP-G80

Length:

20 mm

No. of I/O Lines:

48

No. of Terminals:

80

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

ROM Programmability:

FLASH

Maximum Seated Height:

3.3 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

P80C557E4EFB/01,55 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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