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P5DF081HN/T1AR1070

NXP Semiconductors

P5DF081HN/T1AR1070 by NXP Semiconductors

TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Operating Temperature: -25 Cel;

Median Price

$14.452

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 334 parts In-Stock

1+ parts

$16.190

100+ parts

$12.540

1k+ parts

$12.040

10k+ parts

-

334

$16.190

$12.540

$12.040

-

DigiKey

USA . 395 parts In-Stock

1+ parts

$18.910

100+ parts

$14.451

1k+ parts

$13.278

10k+ parts

-

395

$18.910

$14.451

$13.278

-

Rochester

USA . 508 parts In-Stock

1+ parts

-

100+ parts

$10.170

1k+ parts

$9.100

10k+ parts

$8.560

508

-

$10.170

$9.100

$8.560

Verical

USA . 508 parts In-Stock

1+ parts

-

100+ parts

$12.713

1k+ parts

$11.375

10k+ parts

$10.700

508

-

$12.713

$11.375

$10.700

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,784 parts In-Stock

1+ parts

$10.726

100+ parts

-

1k+ parts

-

10k+ parts

-

3,784

$10.726

-

-

-

Vyrian

USA . 3,509 parts In-Stock

1+ parts

$11.290

100+ parts

-

1k+ parts

-

10k+ parts

-

3,509

$11.290

-

-

-

Anansix

USA . 2,864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,864

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 941 parts In-Stock

1+ parts

$10.161

100+ parts

-

1k+ parts

-

10k+ parts

-

941

$10.161

-

-

-

Perfect Parts

USA . 10,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,976

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

ChipstoGo Electronic ltd

UK . 89 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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89

-

-

-

-

UNI Independent Distributors

Spain . 51 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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51

-

-

-

-

Technical Specifications

Other Function Telecom Interface ICs P5DF081HN/T1AR1070 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

ALSO AVAILABLE WITH 5V NOMINAL SUPPLY

Data Rate:

1.5 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.85 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

P5DF081HN/T1AR1070 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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