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P2041NXE1PNB

NXP Semiconductors

P2041NXE1PNB by NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE;

Median Price

$333.000

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 95 parts In-Stock

1+ parts

$283.400

100+ parts

$266.400

1k+ parts

$249.390

10k+ parts

-

95

$283.400

$266.400

$249.390

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Verical

USA . 95 parts In-Stock

1+ parts

-

100+ parts

$333.000

1k+ parts

$311.738

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95

-

$333.000

$311.738

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Farnell

UK . 73 parts In-Stock

1+ parts

-

100+ parts

$402.240

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-

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73

-

$402.240

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 57 parts In-Stock

1+ parts

$313.376

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57

$313.376

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DigiKey Marketplace

USA . 95 parts In-Stock

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$343.060

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95

$343.060

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Vyrian

USA . 3,100 parts In-Stock

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3,100

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Anansix

USA . 2,866 parts In-Stock

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Nova Conductors

Japan . 45 parts In-Stock

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45

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Distributors (Availability)

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Corohmni

South Africa . 118 parts In-Stock

1+ parts

$64.324

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118

$64.324

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Corphita

USA . 2,758 parts In-Stock

1+ parts

$296.883

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2,758

$296.883

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Vigor

Singapore . 728 parts In-Stock

1+ parts

$316.650

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728

$316.650

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Component Stockers USA

USA . 246 parts In-Stock

1+ parts

$337.000

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246

$337.000

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Microchip USA

USA . 255 parts In-Stock

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$474.975

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255

$474.975

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One Stop Electronics

USA . 84 parts In-Stock

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$610.260

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84

$610.260

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UNI Independent Distributors

Spain . 6,980 parts In-Stock

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6,980

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Continental Prestige Electronics

USA . 1,211 parts In-Stock

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Argo Parts USA

USA . 1,089 parts In-Stock

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1,089

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Technical Specifications

Microprocessors P2041NXE1PNB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B780

Length:

23 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

12

No. of Terminals:

780

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA780,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.51 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

P2041NXE1PNB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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