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NXQ1TXL5/101J

NXP Semiconductors

NXQ1TXL5/101J by NXP Semiconductors

NXP Semiconductors' NXQ1TXL5/101J is a Power Management IC with 32 terminals, operating b/w -20 to 85°C. It supports 2 channels, with a supply voltage range of 3.4V to 5.25V and peak reflow temperature of 260°C. Ideal for power supply support circuits in various applications due to its compact chip carrier package design.

Median Price

$3.532

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,193 parts In-Stock

1+ parts

-

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$3.140

1k+ parts

$2.810

10k+ parts

$2.650

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$3.140

$2.810

$2.650

Verical

USA . 3,193 parts In-Stock

1+ parts

-

100+ parts

$3.925

1k+ parts

$3.513

10k+ parts

$3.313

3,193

-

$3.925

$3.513

$3.313

Distributors (In-Stock)

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Digiode

USA . 1,351 parts In-Stock

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$3.325

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$3.325

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Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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Vyrian

USA . 2,139 parts In-Stock

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Anansix

USA . 1,899 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,958 parts In-Stock

1+ parts

$2.980

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$2.980

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Corphita

USA . 2,886 parts In-Stock

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$3.150

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$3.150

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AZTECH Wire

Italy . 666 parts In-Stock

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$9.270

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$9.270

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Microchip USA

USA . 7,401 parts In-Stock

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$24.543

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$24.543

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,063 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Enhance the efficiency and performance of your power management systems with the NXQ1TXL5/101J by NXP Semiconductors. As a leading manufacturer in the industry, NXP ensures top-notch quality and reliability in all their products. This power management IC boasts a wide range of applications, making it a versatile choice for various projects. With its compact design and advanced features, this product offers unmatched value and benefits to customers looking to optimize their power management solutions. Experience the difference with NXP Semiconductors and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and cost-effective.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on PCBs.

Package Shape: SQUARE

The square package shape helps in efficient utilization of board space and component placement.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with a wide range of electronic devices.

No. of Terminals: 32

The 32 terminals provide flexibility in connectivity and support for various circuit configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package styles of chip carrier, heat sink/slug, and very thin profile offer versatility in design and thermal management.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product is suitable for robust industrial environments.

Minimum Operating Temperature: -20 °C

Operating at a minimum temperature of -20°C ensures reliability in colder conditions.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and connection with other components.

Maximum Seated Height: 0.85 mm

The low maximum seated height of 0.85mm saves space and enables compact designs.

Width (mm): 5 mm

The width of 5mm offers a slim profile, ideal for space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This product serves as a power supply support circuit, enhancing overall system efficiency.

Minimum Supply Voltage (Vsup): 3.4 V

Operating at a minimum supply voltage of 3.4V ensures compatibility with low-power devices.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for robust solder joints and reliable connections.

Length: 5 mm

The length of 5mm contributes to the compact form factor of this product.

No. of Channels: 2

With 2 channels, this product offers dual functionality or redundancy in power management.

Terminal Form: NO LEAD

The no-lead terminal form simplifies manufacturing processes and reduces environmental impact.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm enables high-density mounting and precise connections.

Maximum Supply Voltage (Vsup): 5.25 V

With a maximum supply voltage of 5.25V, this product can handle power fluctuations without compromising performance.

Technical Specifications

Power Management ICs NXQ1TXL5/101J attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Additional Features:

SEATED HEIGHT-NOM

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.85 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

NXQ1TXL5/101J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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