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NX3008NBKMB,315

NXP Semiconductors

NX3008NBKMB,315 by NXP Semiconductors

NX3008NBKMB,315 by NXP Semiconductors is an N-CHANNEL FET with a max drain current of 0.53A and power dissipation of 2.7W. Ideal for applications requiring high efficiency and performance in power management systems. Operating at a max temperature of 150°C, it offers enhanced mode operation and surface mount configuration for easy integration.

Median Price

$0.045

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 870,580 parts In-Stock

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$0.039

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$0.039

Rochester

USA . 740,575 parts In-Stock

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$0.044

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$0.037

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$0.033

740,575

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$0.044

$0.037

$0.033

Chip1Stop

Japan . 30,000 parts In-Stock

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$0.045

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$0.045

Future Electronics

Canada . 20,000 parts In-Stock

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$0.034

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$0.034

Arrow

USA . 10,000 parts In-Stock

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$0.047

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Farnell

UK . 17 parts In-Stock

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$0.140

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$0.074

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Element14

Singapore . 17 parts In-Stock

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$0.171

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17

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Distributors (In-Stock)

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Digiode

USA . 4,201 parts In-Stock

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$0.034

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$0.034

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Nova Conductors

Japan . 1,000 parts In-Stock

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$0.067

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$0.067

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DigiKey Marketplace

USA . 954,603 parts In-Stock

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Chip Stock

USA . 135,000 parts In-Stock

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NAC Semi

USA . 40,000 parts In-Stock

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TME

Poland . 40,000 parts In-Stock

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$0.054

40,000

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$0.054

IBS Electronics

USA . 20,000 parts In-Stock

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$0.049

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Vyrian

USA . 5,240 parts In-Stock

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Elcom Components

USA . 680 parts In-Stock

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Anansix

USA . 89 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 1,627,353 parts In-Stock

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1,627,353

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$0.030

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$0.030

Vigor

Singapore . 734 parts In-Stock

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734

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Semicontronic

India . 234,121 parts In-Stock

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Ampacity Inc.

Singapore . 211,209 parts In-Stock

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Corphita

USA . 1,541 parts In-Stock

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AZTECH Wire

Italy . 8,094 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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$0.066

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$0.063

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$0.066

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Argo Parts USA

USA . 4,993 parts In-Stock

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$0.067

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Microchip USA

USA . 7,049 parts In-Stock

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$0.195

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Continental Prestige Electronics

USA . 1,371,078 parts In-Stock

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$0.076

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Corohmni

South Africa . 178 parts In-Stock

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$0.510

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Aztec Data Supply Inc.

USA . 109 parts In-Stock

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$1.270

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$1.349

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Perfect Parts

USA . 101,069 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,140 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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iodParts Technologies Inc.

India . 9,800 parts In-Stock

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UNI Independent Distributors

Spain . 7,371 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Supply Digital

USA . 105 parts In-Stock

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Overview

Discover the ultimate power solution with the NX3008NBKMB,315 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality Power FETs that excel in performance and reliability. Ideal for a wide range of applications, this N-CHANNEL FET offers enhanced mode operation and a maximum drain current of 0.53 A, providing customers with unparalleled efficiency and power management capabilities. Upgrade your projects with the NX3008NBKMB,315 and experience the value and benefits of cutting-edge semiconductor technology.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and low ON resistance, making them suitable for many power applications.

Configuration: SINGLE

Single configuration FETs are easy to use and provide a simple setup for various circuit designs.

Surface Mount: YES

Surface mount FETs are compact and can be easily integrated into small electronic devices, saving space on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage on the gate to turn them on, which can help prevent accidental activation.

Maximum Drain Current (ID): 0.53 A

With a maximum drain current of 0.53A, this FET can handle moderate power loads effectively.

Maximum Power Dissipation: 2.7 W

The high maximum power dissipation allows the FET to handle power surges and transient conditions without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good efficiency and reliability, making the FET suitable for long-term use.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high temperature environments without compromising performance.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable connection in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

This FET can withstand peak reflow temperatures for up to 30 seconds, allowing for efficient soldering processes during manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FET can undergo reflow soldering processes without experiencing any damage.

Technical Specifications

Power Field Effect Transistors (FET) NX3008NBKMB,315 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.53 A

Maximum Drain Current (ID):

.53 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NX3008NBKMB,315 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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