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NWP2081T/1Y

NXP Semiconductors

NWP2081T/1Y by NXP Semiconductors

NWP2081T/1Y by NXP Semiconductors is a robust MOSFET gate driver designed for automotive applications, operating b/w -40 °C to 150 °C. It features an 8-terminal gull-wing package and supports a nominal voltage of 12.8V. Ideal for efficient power management in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,746 parts In-Stock

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Anansix

USA . 2,833 parts In-Stock

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Vyrian

USA . 2,598 parts In-Stock

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One Stop Electronics

USA . 890 parts In-Stock

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$13.500

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890

$13.500

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$14.325

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$13.036

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$11.746

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450

$14.325

$13.036

$11.746

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AZTECH Wire

Italy . 185 parts In-Stock

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$20.210

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185

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Microchip USA

USA . 7,402 parts In-Stock

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UNI Independent Distributors

Spain . 2,303 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,236 parts In-Stock

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Corphita

USA . 533 parts In-Stock

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533

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Overview

Elevate your designs with the NWP2081T/1Y from NXP Semiconductors, a leading innovator in the semiconductor industry. This robust MOSFET gate driver ensures reliability in automotive applications, thriving under extreme temperatures and delivering optimal performance. With its compact design and superior quality, it simplifies integration while enhancing efficiency, giving you peace of mind and significant competitive advantage in your projects. Unlock unparalleled value and drive innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides excellent insulation properties, protecting the internal components and enhancing durability under various conditions.

Surface Mount: YES

Being a surface mount device (SMD), this MOSFET gate driver facilitates easy assembly and compact design, making it ideal for modern high-density circuit layouts.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space efficiency and thermal performance, providing better heat dissipation and more efficient PCB layout.

Power Supplies (V): 12.8

With a nominal supply voltage of 12.8V, it is well-suited for automotive applications ensuring compatibility with standard automotive power systems.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options, making it suitable for a variety of applications and enabling expanded functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes board space usage while still providing robust performance, ideal for applications where space is limited.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows the device to function reliably even in high-temperature environments, ensuring stability and longevity.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this product suitable for extreme temperature applications, ensuring reliability in harsh conditions.

Terminal Position: DUAL

Dual terminal positioning enhances ease of routing on PCBs, improving design flexibility and layout efficiency.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows for compatibility with high-temperature soldering processes, ensuring reliability during assembly.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, it meets stringent reliability and performance standards essential for safety-critical systems.

Terminal Form: GULL WING

Gull wing terminal form provides excellent mechanical stability and ease of soldering, enhancing the reliability and manufacturability of the device.

Nominal Supply Voltage: 12.8 V

With a nominal supply voltage of 12.8V, it fits perfectly in automotive applications, ensuring reliable operation within standard voltage ranges.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm minimizes the chance of signal interference and improves layout options, suitable for high-speed applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this device is suitable for standard soldering processes, ensuring reliability in varied environmental conditions.

Technical Specifications

MOSFET Gate Drivers NWP2081T/1Y attributes and parameters. Explore more MOSFET Gate Drivers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12.8

Qualification:

Not Qualified

Sub-Category:

MOSFET Drivers

Nominal Supply Voltage:

12.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

NWP2081T/1Y Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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