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NTB0104GU16

NXP Semiconductors

NTB0104GU16 by NXP Semiconductors

NTB0104GU16 by NXP Semiconductors is a 4-bit bus driver with a very thin profile, ideal for automotive applications. It operates b/w 1.2V and 3.6V, featuring a max temp of 125 °C and a propagation delay of just 17.2 ns. Its compact design ensures efficient space utilization in modern electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,380 parts In-Stock

1+ parts

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2,380

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Vyrian

USA . 1,508 parts In-Stock

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1,508

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Anansix

USA . 962 parts In-Stock

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962

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 6,000 parts In-Stock

1+ parts

$11.091

100+ parts

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1k+ parts

$10.648

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$10.648

6,000

$11.091

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$10.648

$10.648

One Stop Electronics

USA . 429 parts In-Stock

1+ parts

$26.000

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429

$26.000

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UNI Independent Distributors

Spain . 4,357 parts In-Stock

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4,357

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Corphita

USA . 1,001 parts In-Stock

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1,001

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Overview

Unlock unparalleled performance with the NTB0104GU16 from NXP Semiconductors—a leader in innovative technology. This compact, high-efficiency bus driver and transceiver elevates your designs with exceptional reliability and thermal range for automotive applications. Experience faster communication and reduced power consumption, all while enjoying the trusted quality of NXP. Transform your projects today with a solution that delivers both value and unmatched versatility!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into existing designs and layouts.

No. of Bits: 4

A 4-bit configuration enables versatile data handling and operational flexibility.

Nominal Supply Voltage / Vsup: 1.5 V

A low nominal supply voltage is energy-efficient, making it ideal for battery-powered applications.

No. of Terminals: 16

Having 16 terminals allows for ample connectivity options and enhances functionality.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile is advantageous for applications where space is limited and height restrictions apply.

Propagation Delay (tpd): 17.2 ns

A low propagation delay ensures faster signal transmission, critical for high-speed applications.

Maximum Operating Temperature: 125 °C

The high maximum temperature rating ensures reliability in automotive and harsh environments.

Output Characteristics: 3-STATE

3-state output allows for flexible signal management, reducing bus contention and enhancing communication.

Minimum Operating Temperature: -40 °C

The ability to function at very low temperatures makes this product suitable for extreme conditions.

Terminal Position: QUAD

Quad terminal positioning assists in efficient layout and routing within circuit designs.

No. of Ports: 2

Two ports enable effective data transfer and device communication, enhancing overall system performance.

Maximum Seated Height: 0.5 mm

The low seated height contributes to the overall compactness, fitting well in space-constrained applications.

Width: 1.8 mm

A narrow width facilitates placement in tight spaces while maintaining performance integrity.

Output Polarity: TRUE

True output polarity indicates compatibility with standard logic levels, ensuring consistent performance.

Minimum Supply Voltage (Vsup): 1.2 V

The capability to operate at a lower supply voltage supports energy-efficient designs.

Length: 2.6 mm

A small length enhances design flexibility and suitability for compact circuit board layouts.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring high durability and reliability under varying conditions.

Terminal Form: NO LEAD

No lead terminal form allows for a smaller footprint and is ideal for modern lead-free soldering techniques.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm supports high-density packaging, increasing the number of components per board.

Maximum Supply Voltage (Vsup): 3.6 V

This wide voltage range allows for versatility in various applications, accommodating different power requirements.

Technical Specifications

Bus Driver & Transceivers NTB0104GU16 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATE AT 1.65 TO 5.5V SUPPLY

Family:

NTB0104

JESD-30 Code:

R-PQCC-N16

Length:

2.6 mm

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Propagation Delay (tpd):

17.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

1.8 mm

Trade Compliance

NTB0104GU16 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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