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MPC8248VRTMFA

NXP Semiconductors

MPC8248VRTMFA by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

Median Price

$85.692

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,006 parts In-Stock

1+ parts

-

100+ parts

$76.170

1k+ parts

$68.150

10k+ parts

$64.140

3,006

-

$76.170

$68.150

$64.140

DigiKey

USA . 2,857 parts In-Stock

1+ parts

-

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-

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2,857

-

-

-

-

Verical

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

$95.213

1k+ parts

$85.188

10k+ parts

$80.175

2,800

-

$95.213

$85.188

$80.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 40 parts In-Stock

1+ parts

$72.900

100+ parts

$61.688

1k+ parts

-

10k+ parts

-

40

$72.900

$61.688

-

-

Digiode

USA . 1,233 parts In-Stock

1+ parts

$80.398

100+ parts

-

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1,233

$80.398

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-

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Vyrian

USA . 4,991 parts In-Stock

1+ parts

$84.630

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4,991

$84.630

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DigiKey Marketplace

USA . 3,506 parts In-Stock

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3,506

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Anansix

USA . 750 parts In-Stock

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750

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Flip Electronics

USA . 112 parts In-Stock

1+ parts

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112

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 756 parts In-Stock

1+ parts

$64.870

100+ parts

-

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756

$64.870

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Corphita

USA . 2,484 parts In-Stock

1+ parts

$76.167

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2,484

$76.167

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Microchip USA

USA . 2,318 parts In-Stock

1+ parts

$216.318

100+ parts

-

1k+ parts

-

10k+ parts

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2,318

$216.318

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A-Z Elektronik GmbH

Germany . 6,677 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,677

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UNI Independent Distributors

Spain . 4,583 parts In-Stock

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4,583

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Perfect Parts

USA . 45 parts In-Stock

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45

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Technical Specifications

Microcontrollers MPC8248VRTMFA attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

30

Bit Size:

32

Maximum Clock Frequency:

66.7 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

57

No. of Terminals:

516

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Speed:

400 rpm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.575 V

Minimum Supply Voltage:

1.425 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC8248VRTMFA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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