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MPC8248VRTIEA

NXP Semiconductors

MPC8248VRTIEA by NXP Semiconductors

NXP Semiconductors' MPC8248VRTIEA microcontroller features 32-bit architecture, 66.7 MHz clock frequency, and 64-bit external data bus width. Ideal for commercial applications, it operates b/w 0-70°C with a supply voltage range of 1.425-1.575 V, offering 57 I/O lines and DMA channels for efficient data transfer.

Median Price

$66.300

Lifecycle Status

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Arrow

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$31.740

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Rochester

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$51.990

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Chip1Stop

Japan . 31 parts In-Stock

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DigiKey

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Verical

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Digiode

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Vyrian

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Anansix

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ComSIT Distribution GmbH

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Microfarads

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LIBRA Elektronik GmbH

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Corohmni

South Africa . 244 parts In-Stock

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Ampacity Inc.

Singapore . 51 parts In-Stock

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Corphita

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Component Stockers USA

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Vigor

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Microchip USA

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Overview

Unlock the power of innovation with the MPC8248VRTIEA microcontroller by NXP Semiconductors. This groundbreaking product offers unmatched quality and reliability, making it the go-to choice for a wide range of applications. From IoT devices to industrial automation, this versatile microcontroller delivers exceptional performance, efficiency, and flexibility. Trust NXP Semiconductors to provide you with cutting-edge technology that drives success and unlocks endless possibilities. Embrace the future with the MPC8248VRTIEA and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the microcontroller from external elements, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount capability allows for easy installation onto circuit boards, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 1.575 V

Operating at a maximum supply voltage of 1.575 V ensures energy efficiency and prevents overheating, extending the lifespan of the microcontroller.

Address Bus Width: 30

A wide address bus width of 30 allows for efficient memory addressing, enabling quick access to data and instructions.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for applications where size is a constraint.

Bit Size: 32

32-bit processing capability ensures high performance and precision in handling complex computations and tasks.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages (1.5V and 3.3V) offers flexibility in design and compatibility with various power sources.

No. of Terminals: 516

Having a high number of terminals (516) allows for a greater degree of connectivity and interface options, expanding the microcontroller's functionality.

Package Style (Meter): GRID ARRAY

The grid array package style provides a reliable and robust interconnection method, ensuring secure placement and connectivity on the circuit board.

Minimum Supply Voltage: 1.425 V

Operating at a minimum supply voltage of 1.425 V ensures stability and consistent performance, even under low-power conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the microcontroller can operate reliably in a wide range of temperature environments.

Minimum Operating Temperature: 0 °C

Being able to operate at a minimum temperature of 0°C ensures that the microcontroller remains functional even in cold conditions.

Terminal Finish: TIN SILVER

Tin silver terminal finish provides durability and corrosion resistance, maintaining reliable electrical connections over time.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making it easier for designers to incorporate the microcontroller into their designs.

Width: 27 mm

Compact width of 27mm allows for space-efficient integration into various electronic devices and systems.

External Data Bus Width: 64

64-bit external data bus width enhances data transfer speed and throughput, enabling faster processing of data-intensive tasks.

Maximum Clock Frequency: 66.7 MHz

High maximum clock frequency of 66.7 MHz ensures rapid execution of instructions and efficient operation of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microcontroller can withstand the reflow soldering process without damage.

Peak Reflow Temperature °C: 245

Peak reflow temperature of 245°C ensures proper soldering during manufacturing, leading to reliable connections and long-term performance.

Length: 27 mm

Compact length of 27mm complements the width dimension, making the microcontroller suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the microcontroller is designed for standard operating conditions, making it suitable for a wide range of commercial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripherals, it offers optimized performance and efficient operation for diverse applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: BALL

Ball terminal form optimizes soldering connections and ensures reliable electrical contacts during operation.

Nominal Supply Voltage: 1.5 V

Having a nominal supply voltage of 1.5V ensures consistent and stable power delivery to the microcontroller for reliable performance.

Terminal Pitch: 1 mm

A terminal pitch of 1mm provides precise spacing between terminals, facilitating easy PCB layout and assembly.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level of 3 indicates the microcontroller's resistance to moisture absorption, making it suitable for various environmental conditions.

Speed: 400 rpm

Operating at a speed of 400 rpm ensures efficient processing of data and commands, enabling swift execution of tasks.

No. of I/O Lines: 57

With 57 I/O lines, the microcontroller offers a versatile interface for connecting and communicating with external devices, expanding its functionality.

Technical Specifications

Microcontrollers MPC8248VRTIEA attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

30

Bit Size:

32

Maximum Clock Frequency:

66.7 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

57

No. of Terminals:

516

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Speed:

400 rpm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.575 V

Minimum Supply Voltage:

1.425 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC8248VRTIEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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