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MMA8110EGR2

NXP Semiconductors

MMA8110EGR2 by NXP Semiconductors

NXP Semiconductors' MMA8110EGR2 is a 16-terminal IC with Vsup ranging from 6.3V to 30V. It operates b/w -40°C to 125°C, making it suitable for automotive applications. With a compact rectangular package style and surface mount capability, it offers precise analog circuit functionality at peak reflow temperatures up to 250°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 1,345 parts In-Stock

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Digiode

USA . 1,206 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

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140

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One Stop Electronics

USA . 1,634 parts In-Stock

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$1.500

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$1.500

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Ampacity Inc.

Singapore . 1,313 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 890 parts In-Stock

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$16.381

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Argo Parts USA

USA . 3,812 parts In-Stock

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Continental Prestige Electronics

USA . 3,700 parts In-Stock

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UNI Independent Distributors

Spain . 2,880 parts In-Stock

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Corphita

USA . 1,461 parts In-Stock

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Aranea Global

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Overview

Unleash the power of the MMA8110EGR2 by NXP Semiconductors, a top-tier manufacturer known for its cutting-edge technology. This versatile semiconductor is perfect for a wide range of applications, offering unmatched quality and reliability. With its compact design and wide temperature range, the MMA8110EGR2 provides exceptional performance in automotive and industrial settings. Trust NXP Semiconductors to deliver the ultimate solution for your semiconductor needs, ensuring seamless integration and superior results every time. Elevate your projects with the MMA8110EGR2 and experience the difference that quality engineering can make.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging makes it easy to mount the product directly onto a printed circuit board, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 9 V

The 9V supply voltage ensures stable and reliable operation of the product within the specified parameters.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space on the PCB while maintaining high functionality.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can operate in a wide range of temperatures, making it versatile and reliable.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and ensures a reliable electrical connection, enhancing the product's overall performance.

Technical Specifications

Other Function Semiconductors MMA8110EGR2 attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-XDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

6.3/30

Qualification:

Not Qualified

Maximum Seated Height:

3.55 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6.3 V

Nominal Supply Voltage (Vsup):

9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

MMA8110EGR2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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