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MMA8110EG

NXP Semiconductors

MMA8110EG by NXP Semiconductors

NXP Semiconductors' MMA8110EG is a 16-terminal analog circuit with a supply voltage range of 6.3V to 30V, suitable for automotive applications. It features a small outline package style, matte tin terminal finish, and operates in temperatures ranging from -40°C to 125°C. The device is surface mountable and has a rectangular shape with dimensions of 10.3mm x 7.5mm x 3.55mm.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Digiode

USA . 3,239 parts In-Stock

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Vyrian

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Anansix

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Nova Conductors

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One Stop Electronics

USA . 2,752 parts In-Stock

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$0.500

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Ampacity Inc.

Singapore . 526 parts In-Stock

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AZTECH Wire

Italy . 294 parts In-Stock

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Continental Prestige Electronics

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UNI Independent Distributors

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Corphita

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Argo Parts USA

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Aranea Global

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Overview

Discover the cutting-edge MMA8110EG by NXP Semiconductors, a top-tier manufacturer of high-quality semiconductors. This versatile product falls under the category of Other Function Semiconductors and boasts a surface mount design for easy installation. With a nominal supply voltage of 9V and a wide operating temperature range, this small outline package offers incredible value and benefits to customers. Perfect for automotive applications, the MMA8110EG provides superior performance and reliability, making it a must-have for your next project. Choose NXP Semiconductors for innovative solutions that elevate your designs to the next level.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure attachment to circuit boards, saving space and facilitating automated manufacturing processes.

Nominal Supply Voltage (Vsup) 9 V

Stable operating voltage that is commonly used in many electrical systems, ensuring compatibility with a wide range of applications.

Maximum Operating Temperature 125 °C

Can withstand high temperature environments, making it suitable for applications where heat dissipation is a concern.

Width (mm) 7.5 mm

Compact size allows for efficient use of space on circuit boards, ideal for designs with limited room.

Temperature Grade AUTOMOTIVE

Designed to meet automotive industry standards for temperature performance, ensuring reliability in the harsh conditions of automotive applications.

Technical Specifications

Other Function Semiconductors MMA8110EG attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-XDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

6.3/30

Qualification:

Not Qualified

Maximum Seated Height:

3.55 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6.3 V

Nominal Supply Voltage (Vsup):

9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

MMA8110EG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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