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MKL82Z128VMP7

NXP Semiconductors

MKL82Z128VMP7 by NXP Semiconductors

NXP Semiconductors' MKL82Z128VMP7 microcontroller features a 32-bit CPU, 131072 ROM words, and 98304 RAM bytes. With a max clock frequency of 32 MHz, it is ideal for applications requiring low power mode, such as IoT devices and sensor networks. The microcontroller also offers connectivity options like I2C, LPUART, SPI, and QSPI for versatile integration.

Median Price

$11.613

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 293 parts In-Stock

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$10.780

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Flip Electronics (Authorized)

USA . 293 parts In-Stock

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Verical

USA . 250 parts In-Stock

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$12.446

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Distributors (In-Stock)

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Digiode

USA . 3,024 parts In-Stock

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$6.728

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Flip Electronics

USA . 4,773 parts In-Stock

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Vyrian

USA . 4,328 parts In-Stock

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Anansix

USA . 126 parts In-Stock

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126

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,411 parts In-Stock

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$6.374

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2,411

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Component Stockers USA

USA . 610 parts In-Stock

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$6.520

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$6.520

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610

$6.520

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Microchip USA

USA . 2,810 parts In-Stock

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$23.057

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Corohmni

South Africa . 100 parts In-Stock

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$83.560

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100

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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UNI Independent Distributors

Spain . 1,987 parts In-Stock

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Netroflash

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Overview

Unlock the potential of your next project with the MKL82Z128VMP7 by NXP Semiconductors, a top-tier microcontroller designed for high-performance applications. With a sleek design and cutting-edge technology, this microcontroller offers unmatched reliability and efficiency. Ideal for a wide range of uses, from IoT devices to industrial automation, the MKL82Z128VMP7 delivers superior performance and functionality. Elevate your projects with the precision and power of NXP Semiconductors' innovative microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body material makes the microcontroller lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V enables compatibility with a wide range of power sources for flexibility in design.

On Chip Data RAM Width: 8

8-bit data RAM width provides sufficient memory capacity for processing and storing data efficiently.

Package Shape: SQUARE

Square package shape allows for compact placement on the PCB, optimizing space usage and design flexibility.

Bit Size: 32

32-bit architecture offers enhanced processing capabilities and performance for demanding applications.

No. of Terminals: 64

64 terminals provide ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design enhances reliability and signal integrity in high-density PCB layouts.

Minimum Supply Voltage: 1.71 V

Support for a minimum supply voltage of 1.71V ensures efficient power usage and compatibility with a wide range of power sources.

Maximum Operating Temperature: 105 °C

Wide operating temperature range up to 105°C enables reliable operation in harsh environmental conditions.

CPU Family: CORTEX-M0

Based on the Cortex-M0 CPU family, known for its energy efficiency and performance, making it suitable for low-power applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for reliable performance in extreme cold environments.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion for sensor interfacing and data acquisition applications.

DMA Channels: YES

DMA channels support efficient data transfer between peripherals and memory, reducing CPU load and improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly, optimizing space and simplifying the design process.

ROM Words: 131072

131072 ROM words provide ample program memory for firmware storage and execution, supporting complex applications.

Maximum Seated Height: 1.23 mm

Low maximum seated height of 1.23mm allows for slim and compact device designs, suitable for space-constrained applications.

Digital To Analog Convertors: 1-Ch 12-Bit

Integrated 12-bit DAC offers high-resolution analog output for precision control and signal generation applications.

Width: 5 mm

Compact width of 5mm enables efficient use of board space and integration into small form factor devices.

Peripherals: DMA(8), POR, RTC, TIMER(16), WDT

Diverse set of peripherals including DMA, POR, RTC, timers, and watchdog timer enhance system functionality and performance.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency of 32MHz allows for fast processing speeds and real-time responsiveness in applications.

Technical Specifications

Microcontrollers MKL82Z128VMP7 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

0

No. of I/O Lines:

41

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

98304

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.23 mm

Speed:

72 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART(3), SPI(2), QSPI

Peripherals:

DMA(8), POR, RTC, TIMER(16), WDT

Analog To Digital Convertors:

11-Ch 16-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MKL82Z128VMP7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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