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MK40DX128VLL7

NXP Semiconductors

MK40DX128VLL7 by NXP Semiconductors

NXP Semiconductors' MK40DX128VLL7 is a 32-bit microcontroller with Cortex-M4 CPU, offering 131072 ROM words and 32768 RAM bytes. It features 34-Ch 16-Bit ADC, 1-Ch 12-Bit DAC, and peripherals like DMA(16) and RTC. Ideal for industrial applications requiring high-speed processing at up to 50 MHz clock frequency.

Median Price

$7.679

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

MK40DX128VLL7 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,900 parts In-Stock

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$7.679

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$7.679

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Nova Conductors

Japan . 69 parts In-Stock

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$8.159

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69

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Digiode

USA . 2,604 parts In-Stock

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Anansix

USA . 1,804 parts In-Stock

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Vyrian

USA . 793 parts In-Stock

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793

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One Stop Electronics

USA . 2,776 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 793 parts In-Stock

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$7.485

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793

$7.485

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Aranea Global

USA . 500 parts In-Stock

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$7.996

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$7.676

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500

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$7.676

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Ampacity Inc.

Singapore . 604 parts In-Stock

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$31.000

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604

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Microchip USA

USA . 1,588 parts In-Stock

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$38.164

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iodParts Technologies Inc.

India . 17,909 parts In-Stock

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Lixinc

USA . 15,449 parts In-Stock

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Corphita

USA . 3,096 parts In-Stock

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UNI Independent Distributors

Spain . 1,092 parts In-Stock

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Perfect Parts

USA . 101 parts In-Stock

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Overview

Unlock the power of next-generation technology with the MK40DX128VLL7 microcontroller by NXP Semiconductors. Designed with precision and expertise, this cutting-edge device offers unparalleled performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers value and efficiency to customers seeking top-notch solutions. Experience seamless connectivity, advanced features, and superior quality with the MK40DX128VLL7, setting new standards for innovation in the industry.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount:

YES - The surface mount feature allows for easy and efficient installation of the microcontroller onto a PCB, saving time and effort during assembly.

Maximum Supply Voltage:

3.6 V - With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, making it versatile for different systems.

Package Shape:

SQUARE - The square package shape ensures a compact and space-saving design, ideal for applications where size matters.

Bit Size:

32 - A 32-bit architecture offers enhanced processing capabilities, making this microcontroller suitable for complex tasks and computations.

DAC Channels:

YES - The presence of DAC channels allows for precise and accurate analog output, enabling the microcontroller to drive various analog components effectively.

Power Supplies (V):

1.8/3.3 - Supporting multiple power supply options gives flexibility in system design and compatibility with different components.

No. of Terminals:

100 - A high number of terminals offer ample connectivity options, allowing for versatile integration with peripherals and external devices.

Package Style (Meter):

FLATPACK, FINE PITCH - This package style provides robust packaging and accurate pin spacing, facilitating secure mounting and connections.

Minimum Supply Voltage:

1.71 V - The low minimum supply voltage requirement ensures efficient power consumption and operation in low-power applications.

Technical Specifications

Microcontrollers MK40DX128VLL7 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

34 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(2), UART(5)

Peripherals:

COMPARATOR(3), DMA(16), RTC, TIMER(12)

Analog To Digital Convertors:

34-Ch 16-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MK40DX128VLL7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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