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MK40DN512VLK10

NXP Semiconductors

MK40DN512VLK10 by NXP Semiconductors

NXP Semiconductors' MK40DN512VLK10 is a 32-bit microcontroller with Cortex-M4 CPU, offering 80 terminals and 131072 bytes of RAM. It operates b/w -40 to 105°C, with a max clock frequency of 32 MHz. Ideal for industrial applications requiring high-speed processing and multiple ADC/DAC channels.

Median Price

$9.400

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 480 parts In-Stock

1+ parts

$17.010

100+ parts

$11.659

1k+ parts

$10.845

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480

$17.010

$11.659

$10.845

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Verical

USA . 960 parts In-Stock

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$9.400

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Avnet

USA . 576 parts In-Stock

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Rochester

USA . 280 parts In-Stock

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$9.370

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$8.380

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$7.890

280

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$9.370

$8.380

$7.890

Flip Electronics (Authorized)

USA . 192 parts In-Stock

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Nova Conductors

Japan . 25 parts In-Stock

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$11.927

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25

$11.927

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Digiode

USA . 4,869 parts In-Stock

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$12.312

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Anansix

USA . 870 parts In-Stock

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Cyclops Electronics Ltd

UK . 480 parts In-Stock

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480

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Chip Stock

USA . 369 parts In-Stock

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369

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Flip Electronics

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Vyrian

USA . 71 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 227 parts In-Stock

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$7.900

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227

$7.900

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Ampacity Inc.

Singapore . 168 parts In-Stock

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$7.900

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$7.900

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Corphita

USA . 2,239 parts In-Stock

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$11.664

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$11.664

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Continental Prestige Electronics

USA . 2,171 parts In-Stock

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$11.927

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$11.688

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$11.927

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$11.688

Netroflash

USA . 2,000 parts In-Stock

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$11.927

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$11.330

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$11.092

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$11.927

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$11.330

$11.092

Microchip USA

USA . 1,642 parts In-Stock

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$35.704

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Corohmni

South Africa . 1,003 parts In-Stock

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$42.071

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$42.071

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Aztec Data Supply Inc.

USA . 125 parts In-Stock

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$76.290

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UNI Independent Distributors

Spain . 5,968 parts In-Stock

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Perfect Parts

USA . 5,914 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,791 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 2,176 parts In-Stock

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Lixinc

USA . 2,119 parts In-Stock

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Overview

Unlock the power of innovation with the MK40DN512VLK10 microcontroller by NXP Semiconductors. This cutting-edge device offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. From automotive to consumer electronics, this microcontroller delivers exceptional performance and efficiency. With advanced features like DAC and ADC channels, as well as DMA capabilities, the MK40DN512VLK10 provides unmatched value and benefits to customers. Trust NXP Semiconductors to elevate your next project to new heights with this innovative microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the microcontroller.

Surface Mount: YES

Allows for easy assembly and integration into various electronic devices.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options for different applications.

Package Shape: SQUARE

Compact design saves space and allows for efficient PCB layout.

Bit Size: 32

Offers high processing power and capability for complex tasks.

DAC Channels: YES

Enables analog output for accurate signal processing.

Power Supplies (V): 1.8/3.3

Supports a wide range of power input for versatile use.

No. of Terminals: 80

Sufficient number of terminals for connecting to peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates a compact and low-profile design for space-constrained applications.

Minimum Supply Voltage: 1.71 V

Ensures operation even with low voltage power sources.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications with variable operating conditions.

CPU Family: CORTEX-M4

Incorporates advanced processing capabilities for efficient performance.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures for use in various environments.

Terminal Finish: TIN

Provides corrosion resistance for long-term reliability.

ADC Channels: YES

Allows for precise analog input measurements.

DMA Channels: YES

Enhances data transfer speed and efficiency for high-performance tasks.

Terminal Position: QUAD

Facilitates easy PCB mounting and soldering.

ROM Words: 524288

Offers ample memory space for storing program and data.

Maximum Seated Height: 1.6 mm

Low-profile design for slim and compact applications.

Width: 12 mm

Compact size for space-efficient design.

Maximum Clock Frequency: 32 MHz

Supports high-speed processing for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes.

Length: 12 mm

Compact form factor for space-saving integration.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments with varying temperatures.

Peripheral IC Type: MICROCONTROLLER, RISC

Features a RISC architecture for efficient data processing.

RAM Bytes: 131072

Provides ample memory for storing data and variables during operation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed.

Terminal Form: GULL WING

Facilitates easy soldering and assembly onto PCBs.

Maximum Supply Current: 77 mA

Efficient power consumption for energy-saving operation.

Nominal Supply Voltage: 3.3 V

Standard voltage supply for compatibility with common power sources.

PWM Channels: YES

Allows for precise control of digital signals for various applications.

ROM Programmability: FLASH

Enables reprogrammable memory for flexibility in application development.

Terminal Pitch: 0.5 mm

Fine pitch for precise soldering and connection to external components.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure during assembly and use.

Speed: 100 rpm

Capable of achieving high processing speed for demanding tasks.

No. of I/O Lines: 52

Sufficient input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers MK40DN512VLK10 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

80

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

77 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MK40DN512VLK10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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