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MK40DX128VLH7

NXP Semiconductors

MK40DX128VLH7 by NXP Semiconductors

NXP Semiconductors MK40DX128VLH7 is a 32-bit microcontroller with Cortex-M4 CPU, 131072 ROM words, and 32768 RAM bytes. It operates at up to 50 MHz clock frequency, suitable for industrial applications requiring high-speed processing and ADC/DAC channels for analog signal conversion. With a compact square package style and low power consumption of 34 mA at 3.3 V, it's ideal for space-constrained embedded systems in various industries.

Median Price

$7.091

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

MK40DX128VLH7 by NXP Semiconductors
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Verical

USA . 9,600 parts In-Stock

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$7.091

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Distributors (In-Stock)

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Nova Conductors

Japan . 700 parts In-Stock

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$8.194

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700

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Flip Electronics

USA . 6,400 parts In-Stock

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Digiode

USA . 3,899 parts In-Stock

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Anansix

USA . 2,055 parts In-Stock

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Vyrian

USA . 782 parts In-Stock

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782

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AZTECH Wire

Italy . 782 parts In-Stock

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$6.036

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Netroflash

USA . 2,000 parts In-Stock

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$8.194

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Ampacity Inc.

Singapore . 826 parts In-Stock

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$13.000

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Component Stockers USA

USA . 8,462 parts In-Stock

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$13.720

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One Stop Electronics

USA . 2,349 parts In-Stock

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$15.000

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Microchip USA

USA . 1,725 parts In-Stock

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$26.014

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Lixinc

USA . 6,551 parts In-Stock

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Corphita

USA . 4,168 parts In-Stock

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UNI Independent Distributors

Spain . 3,337 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of innovation with the MK40DX128VLH7 microcontroller by NXP Semiconductors. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. From smart home automation to industrial automation systems, this microcontroller delivers seamless operation, enhanced capabilities, and exceptional value for customers seeking top-notch quality. Elevate your projects to new heights with the MK40DX128VLH7 and experience the difference of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the microcontroller from external elements, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle a wide range of power inputs without risking damage.

Package Shape: SQUARE

Square package shape aids in efficient placement on the circuit board, optimizing space usage.

Bit Size: 32

32-bit architecture allows for higher processing capabilities and improved performance compared to lower bit microcontrollers.

DAC Channels: YES

Integrated DAC channels enable precise control over analog output signals, enhancing the microcontroller's versatility.

Power Supplies (V): 1.8/3.3

Support for multiple power supply voltages (1.8V and 3.3V) enhances compatibility with different power sources and peripherals.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample connectivity options for interfacing with various sensors, devices, and components.

Package Style (Meter): FLATPACK, FINE PITCH

Flatpack, fine pitch package style ensures efficient thermal management and facilitates high-density PCB layouts.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage requirement (1.71V) allows for operation in low-power scenarios, extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance (105°C) makes this microcontroller suitable for industrial applications with demanding environmental conditions.

CPU Family: CORTEX-M4

Utilization of Cortex-M4 CPU family ensures efficient processing capabilities, offering a balance between performance and power consumption.

Minimum Operating Temperature: -40 °C

Wide operating temperature range (-40°C to 105°C) enables reliable performance in both extreme cold and hot environments.

Terminal Finish: TIN

Tin terminal finish provides corrosion resistance and ensures reliable electrical connections over extended periods of use.

ADC Channels: YES

Built-in ADC channels enable accurate analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and devices.

DMA Channels: YES

Support for Direct Memory Access (DMA) channels enhances data transfer efficiency, reducing CPU workload and boosting overall system performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easy soldering and maintenance, simplifying the manufacturing and assembly process.

ROM Words: 131072

Generous ROM size of 131072 words provides ample space for storing firmware, program code, and data, enabling complex applications to run smoothly.

Width: 10 mm

Compact width of 10mm allows for space-efficient integration into electronic devices, especially those with size constraints.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency of 50 MHz ensures rapid data processing and execution speed, catering to time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 40

The microcontroller can withstand peak reflow temperatures for up to 40 seconds during assembly, ensuring proper soldering and component bonding.

Peak Reflow Temperature °C: 260

Peak reflow temperature tolerance of 260°C allows for reliable soldering and assembly processes, ensuring robust connections.

Length: 10 mm

Length of 10mm contributes to the overall compact form factor of the microcontroller, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments with fluctuating temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, this product integrates various peripherals and features essential for embedded system applications, offering a comprehensive solution.

RAM Bytes: 32768

With 32768 bytes of RAM, this microcontroller provides sufficient memory for temporary data storage and efficient multitasking operations.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and excellent reliability, making the microcontroller energy-efficient and dependable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and rework, ensuring reliable electrical connections and simplifying the manufacturing process.

Maximum Supply Current: 34 mA

Low maximum supply current of 34 mA helps in minimizing power consumption, extending battery life in portable and battery-operated devices.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures stable and consistent power delivery, allowing the microcontroller to operate within its specified parameters.

PWM Channels: YES

Presence of PWM channels enables precise control over pulse-width modulation signals, essential for applications requiring accurate and synchronized output signals.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and software, allowing for easy reprogramming and system upgrades.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm facilitates high-density mounting on the PCB, enabling compact and miniaturized designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard precautions during handling, storage, and assembly processes.

Speed: 72 rpm

Operating at a speed of 72 rpm, this microcontroller offers rapid processing capabilities and efficient data handling for timely execution of tasks.

No. of I/O Lines: 36

With 36 input/output lines, the microcontroller provides ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing versatility and functionality.

Technical Specifications

Microcontrollers MK40DX128VLH7 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

34 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MK40DX128VLH7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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