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MCZ33810EK

NXP Semiconductors

MCZ33810EK by NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR;

Median Price

$8.210

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

MCZ33810EK by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 264 parts In-Stock

1+ parts

$4.585

100+ parts

-

1k+ parts

-

10k+ parts

-

264

$4.585

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-

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Chip1Stop

Japan . 266 parts In-Stock

1+ parts

$6.950

100+ parts

$6.510

1k+ parts

-

10k+ parts

-

266

$6.950

$6.510

-

-

DigiKey

USA . 229 parts In-Stock

1+ parts

$8.210

100+ parts

$5.670

1k+ parts

$4.983

10k+ parts

$4.862

229

$8.210

$5.670

$4.983

$4.862

Mouser Electronics

USA . 125 parts In-Stock

1+ parts

$8.210

100+ parts

$5.300

1k+ parts

$4.980

10k+ parts

$4.860

125

$8.210

$5.300

$4.980

$4.860

Farnell

UK . 101 parts In-Stock

1+ parts

$8.500

100+ parts

$5.590

1k+ parts

$5.480

10k+ parts

-

101

$8.500

$5.590

$5.480

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Newark

USA . 70 parts In-Stock

1+ parts

$9.880

100+ parts

$7.550

1k+ parts

$7.180

10k+ parts

-

70

$9.880

$7.550

$7.180

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Element14

Singapore . 146 parts In-Stock

1+ parts

$13.930

100+ parts

$10.600

1k+ parts

$9.800

10k+ parts

-

146

$13.930

$10.600

$9.800

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Verical

USA . 264 parts In-Stock

1+ parts

-

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264

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,117 parts In-Stock

1+ parts

$5.528

100+ parts

-

1k+ parts

-

10k+ parts

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3,117

$5.528

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Vyrian

USA . 4,184 parts In-Stock

1+ parts

$5.585

100+ parts

-

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10k+ parts

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4,184

$5.585

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Chip Stock

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,500

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-

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Anansix

USA . 2,480 parts In-Stock

1+ parts

-

100+ parts

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2,480

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Flip Electronics

USA . 714 parts In-Stock

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714

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,882 parts In-Stock

1+ parts

$5.237

100+ parts

-

1k+ parts

-

10k+ parts

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3,882

$5.237

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Continental Prestige Electronics

USA . 158 parts In-Stock

1+ parts

$6.810

100+ parts

$5.020

1k+ parts

-

10k+ parts

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158

$6.810

$5.020

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-

Microchip USA

USA . 2,000 parts In-Stock

1+ parts

$31.472

100+ parts

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10k+ parts

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2,000

$31.472

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iodParts Technologies Inc.

India . 37,212 parts In-Stock

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37,212

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UNI Independent Distributors

Spain . 7,808 parts In-Stock

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7,808

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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100+ parts

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7,000

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A-Z Elektronik GmbH

Germany . 6,854 parts In-Stock

1+ parts

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6,854

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S.R.D Solutions

India . 1,500 parts In-Stock

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1,500

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Perfect Parts

USA . 372 parts In-Stock

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372

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Technical Specifications

Peripheral Drivers MCZ33810EK attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

1 A

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,9/18

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Turn-off Time:

5 us

Turn-on Time:

5 us

Width:

7.5 mm

Trade Compliance

MCZ33810EK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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